CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
DC Electrical Specifications
V
CC
= 5V
±10%;
T
A
= -40
o
C to +85
o
C (HM-6516B-9, HM-6516-9)
LIMITS
SYMBOL
ICCSB
PARAMETER
Standby Supply Current
MIN
-
MAX
50
UNITS
µA
µA
mA
µA
µA
V
µA
µA
V
V
V
V
V
TEST CONDITIONS
IO = 0mA, VI = V
CC
or GND,
V
CC
= 5.5V, HM-6516B-9
IO = 0mA, VI = V
CC
or GND,
HM-6516-9
f = 1MHz, IO = 0mA, G = V
CC
, V
CC
=
5.5V, VI = V
CC
or GND
V
CC
= 2.0V, IO = 0mA, VI = V
CC
or
GND, E = V
CC
, HM-6516B-9
V
CC
= 2.0V, IO = 0mA, VI = V
CC
or
GND, E = V
CC
, HM-6516-9
-
100
ICCOP
Operating Supply Current (Note 1)
-
10
ICCDR
Data Retention Supply Current
-
25
-
50
VCCDR
II
IIOZ
V
IL
V
IH
VOL
VOH1
VOH2
Data Retention Supply Voltage
Input Leakage Current
Input/Output Leakage Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Output High Voltage (Note 2)
T
A
= +25
o
C
PARAMETER
Input Capacitance (Note 2)
Input/Output Capacitance (Note 2)
2.0
-1.0
-1.0
-0.3
2.4
-
2.4
V
CC
-0.4
-
+1.0
+1.0
0.8
V
CC
+0.3
0.4
-
-
VI = V
CC
or GND, V
CC
= 5.5V
VIO = V
CC
or GND, V
CC
= 5.5V
V
CC
= 4.5V
V
CC
= 5.5V
IO = 3.2mA, V
CC
= 4.5V
IO = -1.0mA, V
CC
= 4.5V
IO = -100µA, V
CC
= 4.5V
Capacitance
SYMBOL
CI
CIO
NOTES:
MAX
8
10
UNITS
pF
pF
TEST CONDITIONS
f = 1MHz, All measurements are
referenced to device GND
1. Typical derating 5mA/MHz increase in ICCOP.
2. Tested at initial design and after major design changes.
6-3
HM-6516
AC Electrical Specifications
V
CC
= 5V
±10%;
T
A
= -40
o
C to +85
o
C (HM-6516B-9, HM-6516-9)
LIMITS
HM-6516B-9
SYMBOL
(1)
TELQV
(2)
TAVQV
(3)
TELQX
(4)
TWLQZ
(5)
TEHQZ
(6)
TGLQV
(7)
TGLQX
(8)
TGHQZ
(9)
TELEH
(10)
TEHEL
(11)
TAVEL
(12)
TELAX
(13)
TWLWH
(14)
TWLEH
(15)
TELWH
(16)
TDVWH
(17)
TWHDX
(18)
TELEL
HM-6516-9
MIN
-
-
10
-
-
-
10
-
200
80
0
50
200
200
200
80
10
280
MAX
200
200
-
80
80
80
-
80
-
-
-
-
-
-
-
-
-
-
UNITS
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
TEST
CONDITIONS
(Notes 1, 3)
(Notes 1, 3, 4)
(Notes 2, 3)
(Notes 2, 3)
(Notes 2, 3)
(Notes 1, 3)
(Notes 2, 3)
(Notes 2, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
(Notes 1, 3)
PARAMETER
Chip Enable Access Time
Address Access Time
Chip Enable Output Enable Time
Write Enable Output Disable Time
Chip Enable Output Disable Time
Output Enable Output Valid Time
Output Enable Output Enable Time
Output Enable Output DisableTime
Chip Enable Pulse Negative Width
Chip Enable Pulse Positive Width
Address Setup Time
Address Hold Time
Write Enable Pulse Width
Write Enable Pulse Setup Time
Write Enable Pulse Hold Time
Data Setup Time
Data Hold Time
Read or Write Cycle Time
MIN
-
-
10
-
-
-
10
-
120
50
0
30
120
120
120
50
10
170
MAX
120
120
-
50
50
80
-
50
-
-
-
-
-
-
-
-
-
-
NOTES:
1. Input pulse levels: 0.8V to V
CC
- 2.0V; Input rise and fall times: 5ns (max); Input and output timing reference level: 1.5V; Output load:
1 TTL gate equivalent, C
L
= 50pF (min) - for C
L
greater than 50pF, access time is derated by 0.15ns per pF.
2. Tested at initial design and after major design changes.
3. V
CC
= 4.5V and 5.5V.
4. TAVQV = TELQV + TAVEL.
6-4
HM-6516
Timing Waveforms
(2)
TAVQV
(12)
TELAX
(11)
A
(10)
TEHEL
E
HIGH
W
(5)
TEHQZ
(1)
TELQV
(5)
TEHQZ
TAVEL
VALID ADD
(18)
TELEL
(11)
TAVEL
NEXT
ADD
(9)
TELEH
(10)
TEHEL
(3)
TELQX
DQ
(6)
TGLQV
G
(7)
TGLQX
TIME
REFERENCE
-1
0
1
VALID DATA OUT
TGHQZ
(8)
2
3
4
5
FIGURE 1. READ CYCLE
The address information is latched in the on-chip registers
on the falling edge of E (T = 0), minimum address setup and
hold time requirements must be met. After the required hold
time, the addresses may change state without affecting
device operation. During time (T = 1), the outputs become
enabled but data is not valid until time (T = 2), W must
remain high throughout the read cycle. After the data has
been read, E may return high (T = 3). This will force the out-
put buffers into a high impedance mode at time (T = 4). G is
used to disable the output buffers when in a logical “1” state
(T = -1, 0, 3, 4, 5). After (T = 4) time, the memory is ready for
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Microcontroller MCU
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