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AT17C002

Description
2M X 1 CONFIGURATION MEMORY, PQCC20
Categorystorage   
File Size165KB,19 Pages
ManufacturerAtmel (Microchip)
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AT17C002 Overview

2M X 1 CONFIGURATION MEMORY, PQCC20

AT17C002 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals20
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage3 V
Rated supply voltage3.3 V
maximum clock frequency10 MHz
Processing package descriptionPlastic, MS-018AA, LCC-20
stateDISCONTINUED
CraftsmanshipCMOS
packaging shapeSQUARE
Package SizeChipCARRIER
surface mountYes
Terminal formJ BEND
Terminal spacing1.27 mm
terminal coatingtin lead
Terminal locationFour
Packaging MaterialsPlastic/Epoxy
Temperature levelINDUSTRIAL
memory width1
organize2M × 1
storage density2.10E6 deg
operating modeSynchronize
Number of digits2.10E6 words
Number of digits2M
Memory IC typeconfiguration memory
serial parallelserial
Features
EE Reprogrammable 2,097,152 x 1-bit Serial Memories Designed to Store
Configuration Programs for Field Programmable Gate Arrays (FPGAs)
In-System Programmable via 2-wire Bus
Simple Interface to SRAM FPGAs
Compatible with Atmel AT6000, AT40K and AT94K Devices, Altera FLEX
®
, APEX
Devices, Lucent ORCA
®
FPGAs, Xilinx XC3000
, XC4000
, XC5200
, Spartan
®
,
Virtex
FPGAs
Cascadable Read Back to Support Additional Configurators or Higher-density Arrays
Low-power CMOS EEPROM Process
Programmable Reset Polarity
Available in 6 mm x 6 mm x 1 mm 8-lead LAP (Pin-compatible with 8-lead SOIC/VOIC
Packages), 20-lead PLCC, 44-lead PLCC and 44-lead TQFP Packages (Pin-compatible
Across Product Family)
Emulation of Atmel’s AT24CXXX Serial EEPROMs
Available in 3.3V ± 10% LV and 5V ± 5% C Versions
System-friendly READY Pin
Low-power Standby Mode
Replacement for AT17C/LV020
FPGA
Configuration
EEPROM
Memory
2-megabit
Description
The AT17C002 and AT17LV002 (high-density AT17 Series) FPGA Configuration
EEPROMs (Configurators) provide an easy-to-use, cost-effective configuration mem-
ory for programming Field Programmable Gate Arrays. The AT17 Series is packaged
in the popular 8-lead LAP, 20-lead PLCC, 44-lead PLCC and the 44-lead TQFP. The
AT17 Series family uses a simple serial-access procedure to configure one or more
FPGA devices. The user can select the polarity of the reset function by programming
four EEPROM bytes. These devices support a write protection mode and a system-
friendly READY pin, which signifies a “good” power level to the FPGA and can be used
to ensure reliable system power-up.
The AT17 Series Configurators can be programmed with industry-standard program-
mers, Atmel’s ATDH2200E Programming System and Atmel’s ATDH2225 ISP Cable.
AT17C002
AT17LV002
Rev. 2281D–12/01
1

AT17C002 Related Products

AT17C002 AT17C002-10BJI AT17C002-10BJC AT17C002-10CI AT17C002-10CC AT17C002-10JI AT17C002-10TQI AT17C002-10JC AT17C002-10TQC
Description 2M X 1 CONFIGURATION MEMORY, PQCC20 2M X 1 CONFIGURATION MEMORY, PQCC20 2M X 1 CONFIGURATION MEMORY, PQCC20 2M X 1 CONFIGURATION MEMORY, PQCC20 2M X 1 CONFIGURATION MEMORY, PQCC20 2M X 1 CONFIGURATION MEMORY, PQCC20 2M X 1 CONFIGURATION MEMORY, PQCC20 2M X 1 CONFIGURATION MEMORY, PQCC20 2M X 1 CONFIGURATION MEMORY, PQCC20
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 20 44 44 8 8 20 44 20 44
Maximum operating temperature 85 Cel 85 °C 70 °C 85 °C 70 °C 85 °C 85 °C 70 °C 70 °C
Minimum operating temperature -40 Cel -40 °C - -40 °C - -40 °C -40 °C - -
surface mount Yes YES YES YES YES YES YES YES YES
Terminal form J BEND J BEND J BEND NO LEAD NO LEAD J BEND GULL WING J BEND GULL WING
Terminal location Four QUAD QUAD DUAL DUAL QUAD QUAD QUAD QUAD
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
memory width 1 1 1 1 1 1 1 1 1
organize 2M × 1 2MX1 2MX1 2MX1 2MX1 2MX1 2MX1 2MX1 2MX1
Is it Rohs certified? - incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker - Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Parts packaging code - LCC LCC SOIC SOIC QLCC QFP QLCC QFP
package instruction - QCCJ, LDCC44,.7SQ QCCJ, LDCC44,.7SQ SON, SOLCC8,.25 SON, SOLCC8,.25 QCCJ, LDCC20,.4SQ TQFP, TQFP44,.47SQ,32 QCCJ, LDCC20,.4SQ TQFP, TQFP44,.47SQ,32
Contacts - 44 44 8 8 20 44 20 44
Reach Compliance Code - unknow unknow unknow unknow unknow unknow unknow unknow
ECCN code - EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
JESD-30 code - S-PQCC-J44 S-PQCC-J44 S-PDSO-N8 S-PDSO-N8 S-PQCC-J20 S-PQFP-G44 S-PQCC-J20 S-PQFP-G44
JESD-609 code - e0 e0 e0 e0 e0 e0 e0 e0
length - 16.586 mm 16.586 mm 5.99 mm 5.99 mm 8.966 mm 10 mm 8.966 mm 10 mm
memory density - 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi 2097152 bi
Memory IC Type - CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY
Humidity sensitivity level - 2 2 3 3 2 - 2 -
word count - 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code - 2000000 2000000 2000000 2000000 2000000 2000000 2000000 2000000
Operating mode - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - QCCJ QCCJ SON SON QCCJ TQFP QCCJ TQFP
Encapsulate equivalent code - LDCC44,.7SQ LDCC44,.7SQ SOLCC8,.25 SOLCC8,.25 LDCC20,.4SQ TQFP44,.47SQ,32 LDCC20,.4SQ TQFP44,.47SQ,32
Package shape - SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form - CHIP CARRIER CHIP CARRIER SMALL OUTLINE SMALL OUTLINE CHIP CARRIER FLATPACK, THIN PROFILE CHIP CARRIER FLATPACK, THIN PROFILE
Parallel/Serial - SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) - 225 225 240 240 225 NOT SPECIFIED 225 NOT SPECIFIED
power supply - 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height - 4.572 mm 4.572 mm 1.14 mm 1.14 mm 4.572 mm 1.2 mm 4.572 mm 1.2 mm
Maximum standby current - 0.00075 A 0.0005 A 0.00075 A 0.0005 A 0.00075 A 0.00075 A 0.0005 A 0.0005 A
Maximum slew rate - 0.01 mA 0.01 mA 0.01 mA 0.01 mA 0.01 mA 0.01 mA 0.01 mA 0.01 mA
Maximum supply voltage (Vsup) - 5.5 V 5.25 V 5.5 V 5.25 V 5.5 V 5.5 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) - 4.5 V 4.75 V 4.5 V 4.75 V 4.5 V 4.5 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) - 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
technology - CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal pitch - 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 0.8 mm 1.27 mm 0.8 mm
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 16.586 mm 16.586 mm 5.99 mm 5.99 mm 8.966 mm 10 mm 8.966 mm 10 mm
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