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A80960KB

Description
RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,102 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
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A80960KB Overview

RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132

A80960KB Parametric

Parameter NameAttribute value
MakerIntel
Parts packaging codePGA
package instructionPGA,
Contacts132
Reach Compliance Codeunknown
Address bus width32
bit size32
boundary scanNO
maximum clock frequency25 MHz
External data bus width32
FormatFLOATING POINT
Integrated cacheNO
JESD-30 codeS-CPGA-P132
length36.802 mm
low power modeNO
Number of terminals132
Maximum operating temperature85 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codePGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
Maximum seat height4.061 mm
speed25 MHz
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelOTHER
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
width36.802 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC
Base Number Matches1
Intel i960 RM/RN I/O Processor
Design Guide
April 2002
®
®
Order Number:
273139-004

A80960KB Related Products

A80960KB NG80960KB
Description RISC Microprocessor, 32-Bit, 25MHz, CMOS, CPGA132, 2.54 MM PITCH, CERAMIC, PGA-132 RISC Microprocessor, 32-Bit, 25MHz, CMOS, PQFP132, PLASTIC, QFP-132
Maker Intel Intel
Parts packaging code PGA QFP
package instruction PGA, BQFP,
Contacts 132 132
Reach Compliance Code unknown unknown
Address bus width 32 32
bit size 32 32
boundary scan NO NO
maximum clock frequency 25 MHz 25 MHz
External data bus width 32 32
Format FLOATING POINT FLOATING POINT
Integrated cache NO NO
JESD-30 code S-CPGA-P132 S-PQFP-G132
length 36.802 mm 24.13 mm
low power mode NO NO
Number of terminals 132 132
Maximum operating temperature 85 °C 85 °C
Package body material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
encapsulated code PGA BQFP
Package shape SQUARE SQUARE
Package form GRID ARRAY FLATPACK, BUMPER
Certification status Not Qualified Not Qualified
Maximum seat height 4.061 mm 4.32 mm
speed 25 MHz 25 MHz
Maximum supply voltage 5.25 V 5.25 V
Minimum supply voltage 4.75 V 4.75 V
Nominal supply voltage 5 V 5 V
surface mount NO YES
technology CMOS CMOS
Temperature level OTHER OTHER
Terminal form PIN/PEG GULL WING
Terminal pitch 2.54 mm 0.635 mm
Terminal location PERPENDICULAR QUAD
width 36.802 mm 24.13 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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