54AC192LM datasheet, PDF - EEWORLD Datasheet

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54AC192LM: DescriptionIC,COUNTER,UP/DOWN,DECADE,AC-CMOS,LLCC,20PIN,CERAMIC; Categorylogic logic; File Size413KB，7 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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54AC192LM Overview

IC,COUNTER,UP/DOWN,DECADE,AC-CMOS,LLCC,20PIN,CERAMIC

54AC192LM Parametric

Parameter Name	Attribute value
Maker	National Semiconductor（TI ）
package instruction	QCCN, LCC20,.35SQ
Reach Compliance Code	unknown
Counting direction	BIDIRECTIONAL
JESD-30 code	S-XQCC-N20
Load capacitance (CL)	50 pF
Load/preset input	YES
Logic integrated circuit type	DECADE COUNTER
Operating mode	SYNCHRONOUS
Number of functions	2
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC20,.35SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	3.3/5 V
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Base Number Matches	1

54AC192LM Related Products

	54AC192LM	54AC192DM	54AC193LM	54AC193DM
Description	IC,COUNTER,UP/DOWN,DECADE,AC-CMOS,LLCC,20PIN,CERAMIC	IC,COUNTER,UP/DOWN,DECADE,AC-CMOS,DIP,16PIN,CERAMIC	IC,COUNTER,UP/DOWN,4-BIT BINARY,AC-CMOS,LLCC,20PIN,CERAMIC	IC,COUNTER,UP/DOWN,4-BIT BINARY,AC-CMOS,DIP,16PIN,CERAMIC
package instruction	QCCN, LCC20,.35SQ	DIP, DIP16,.3	QCCN, LCC20,.35SQ	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
Counting direction	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL	BIDIRECTIONAL
JESD-30 code	S-XQCC-N20	R-XDIP-T16	S-XQCC-N20	R-XDIP-T16
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF
Load/preset input	YES	YES	YES	YES
Logic integrated circuit type	DECADE COUNTER	DECADE COUNTER	BINARY COUNTER	BINARY COUNTER
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Number of functions	2	2	1	1
Number of terminals	20	16	20	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	QCCN	DIP	QCCN	DIP
Encapsulate equivalent code	LCC20,.35SQ	DIP16,.3	LCC20,.35SQ	DIP16,.3
Package shape	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE
power supply	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	QUAD	DUAL	QUAD	DUAL
Base Number Matches	1	1	1	1
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	-	National Semiconductor（TI ）

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