3D2D4G72UB3478MS-00 datasheet, PDF

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3D2D4G72UB3478MS-00: DescriptionDDR DRAM, 64MX72, CMOS, PBGA191, BGA-191; Categorystorage storage; File Size207KB，2 Pages; Manufacturer3D PLUS

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3D2D4G72UB3478MS-00 Overview

DDR DRAM, 64MX72, CMOS, PBGA191, BGA-191

3D2D4G72UB3478MS-00 Parametric

Parameter Name	Attribute value
Maker	3D PLUS
package instruction	BGA,
Reach Compliance Code	unknown
access mode	MULTI BANK PAGE BURST
Other features	PROGRAMMABLE CAS LATENCY
JESD-30 code	R-PBGA-B191
length	29 mm
memory density	4831838208 bit
Memory IC Type	DDR DRAM
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	191
word count	67108864 words
character code	64000000
Operating mode	SYNCHRONOUS
organize	64MX72
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Maximum seat height	7.9 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	19 mm
Base Number Matches	1

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MEMORY MODULE

DDR2 SDRam 64Mx72-BGA

DDR2 SDRAM

MODULE

3D 2D4G72UB3478

4Gbit DDR2 SDRam organized as 64Mx72, based on 64Mx16

Pin Assignment

BGA 191 - (12x20 - Pitch 1.27mm)

Features



Organized as 64Mx72



Core supply voltage 1.8V +/- 0.1V



I/O supply voltage 1.8V +/- 0.1V



Jedec standard 1.8V I/0 (SSTL_18 compatible)



Max Data rate = 467 Mbps



Differential data strobe per byte



4n-bit prefetch architecture



DLL to align DQ and DQS transitions with CK



8 internal banks per die for concurrent operation



Programmable CAS Latency



Posted CAS Additive Latency



Write Latency = Read Latency - 1Tck



Programmable Burst Lengths: 4 or 8



On-Die Termination



191 leaded or lead-free balls.



Available temperature range :

0°C to +70°C

-40°C to +85°C



Available with screening option for high reliability

application (Space, etc…)

FUNCTIONAL BLOCK DIAGRAM

General description

The 3D2D4G72UB3478 is a high-speed highly

integrated DDR2 Synchronous Dynamic Ram

Memory. It is organized with 4 chips of 1Gbit + 1 chip

for ECC. It is particularly well suited for use in high

reliability, high performance and high density system

applications, such as servers or workstations. The

3D2D4G72UB3478 is packaged in a 191 balls BGA

available with lead-free or leaded balls.

DDR2 SDRam Module

Preliminary

3D Plus SA reserves the right to cancel product or specifications without notice

3DFP-0478-REV 3-Dec 2012

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Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

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