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HYB39M83200Q-100

Description
Synchronous DRAM, 256KX32, MOS, PQFP128, PLASTIC, QFP-128
Categorystorage    storage   
File Size528KB,22 Pages
ManufacturerSIEMENS
Websitehttp://www.infineon.com/
Download Datasheet Parametric Compare View All

HYB39M83200Q-100 Overview

Synchronous DRAM, 256KX32, MOS, PQFP128, PLASTIC, QFP-128

HYB39M83200Q-100 Parametric

Parameter NameAttribute value
MakerSIEMENS
Parts packaging codeQFP
package instruction,
Contacts128
Reach Compliance Codeunknown
ECCN codeEAR99
access modeMULTI BANK PAGE BURST
JESD-30 codeR-PQFP-G128
memory density8388608 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width32
Number of functions1
Number of ports1
Number of terminals128
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formFLATPACK
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.47 V
Minimum supply voltage (Vsup)3.14 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal locationQUAD
Base Number Matches1

HYB39M83200Q-100 Related Products

HYB39M83200Q-100 HYB39M93200L-100 HYB39M93200Q-100 HYB39M83200L-100 HYB39M83200L-125 HYB39M83200Q-125 HYB39M93200Q-125 HYB39M93200L-125
Description Synchronous DRAM, 256KX32, MOS, PQFP128, PLASTIC, QFP-128 Synchronous DRAM, 288KX32, MOS, PQCC68, PLASTIC, QCC-68 Synchronous DRAM, 288KX32, MOS, PQFP128, PLASTIC, QFP-128 Synchronous DRAM, 256KX32, MOS, PQCC68, PLASTIC, QCC-68 Synchronous DRAM, 256KX32, MOS, PQCC68, PLASTIC, QCC-68 Synchronous DRAM, 256KX32, MOS, PQFP128, PLASTIC, QFP-128 Synchronous DRAM, 288KX32, MOS, PQFP128, PLASTIC, QFP-128 Synchronous DRAM, 288KX32, MOS, PQCC68, PLASTIC, QCC-68
Parts packaging code QFP LCC QFP LCC LCC QFP QFP LCC
Contacts 128 68 128 68 68 128 128 68
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST MULTI BANK PAGE BURST
JESD-30 code R-PQFP-G128 S-PQCC-J68 R-PQFP-G128 S-PQCC-J68 S-PQCC-J68 R-PQFP-G128 R-PQFP-G128 S-PQCC-J68
memory density 8388608 bit 9437184 bit 9437184 bit 8388608 bit 8388608 bit 8388608 bit 9437184 bit 9437184 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 32 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1
Number of terminals 128 68 128 68 68 128 128 68
word count 262144 words 294912 words 294912 words 262144 words 262144 words 262144 words 294912 words 294912 words
character code 256000 288000 288000 256000 256000 256000 288000 288000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX32 288KX32 288KX32 256KX32 256KX32 256KX32 288KX32 288KX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR SQUARE RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR SQUARE
Package form FLATPACK CHIP CARRIER FLATPACK CHIP CARRIER CHIP CARRIER FLATPACK FLATPACK CHIP CARRIER
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 3.47 V 3.47 V 3.47 V 3.47 V 3.47 V 3.47 V 3.47 V 3.47 V
Minimum supply voltage (Vsup) 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V 3.14 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES
technology MOS MOS MOS MOS MOS MOS MOS MOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING J BEND GULL WING J BEND J BEND GULL WING GULL WING J BEND
Terminal location QUAD QUAD QUAD QUAD QUAD QUAD QUAD QUAD
Maker SIEMENS SIEMENS - - SIEMENS SIEMENS SIEMENS SIEMENS

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