Synchronous DRAM, 288KX32, MOS, PQCC68, PLASTIC, QCC-68
| Parameter Name | Attribute value |
| Maker | SIEMENS |
| Parts packaging code | LCC |
| package instruction | , |
| Contacts | 68 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | MULTI BANK PAGE BURST |
| JESD-30 code | S-PQCC-J68 |
| memory density | 9437184 bit |
| Memory IC Type | SYNCHRONOUS DRAM |
| memory width | 32 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 68 |
| word count | 294912 words |
| character code | 288000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 288KX32 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 3.47 V |
| Minimum supply voltage (Vsup) | 3.14 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | MOS |
| Temperature level | COMMERCIAL |
| Terminal form | J BEND |
| Terminal location | QUAD |
| HYB39M93200L-125 | HYB39M93200L-100 | HYB39M83200Q-100 | HYB39M93200Q-100 | HYB39M83200L-100 | HYB39M83200L-125 | HYB39M83200Q-125 | HYB39M93200Q-125 | |
|---|---|---|---|---|---|---|---|---|
| Description | Synchronous DRAM, 288KX32, MOS, PQCC68, PLASTIC, QCC-68 | Synchronous DRAM, 288KX32, MOS, PQCC68, PLASTIC, QCC-68 | Synchronous DRAM, 256KX32, MOS, PQFP128, PLASTIC, QFP-128 | Synchronous DRAM, 288KX32, MOS, PQFP128, PLASTIC, QFP-128 | Synchronous DRAM, 256KX32, MOS, PQCC68, PLASTIC, QCC-68 | Synchronous DRAM, 256KX32, MOS, PQCC68, PLASTIC, QCC-68 | Synchronous DRAM, 256KX32, MOS, PQFP128, PLASTIC, QFP-128 | Synchronous DRAM, 288KX32, MOS, PQFP128, PLASTIC, QFP-128 |
| Parts packaging code | LCC | LCC | QFP | QFP | LCC | LCC | QFP | QFP |
| Contacts | 68 | 68 | 128 | 128 | 68 | 68 | 128 | 128 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST |
| JESD-30 code | S-PQCC-J68 | S-PQCC-J68 | R-PQFP-G128 | R-PQFP-G128 | S-PQCC-J68 | S-PQCC-J68 | R-PQFP-G128 | R-PQFP-G128 |
| memory density | 9437184 bit | 9437184 bit | 8388608 bit | 9437184 bit | 8388608 bit | 8388608 bit | 8388608 bit | 9437184 bit |
| Memory IC Type | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
| memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 68 | 68 | 128 | 128 | 68 | 68 | 128 | 128 |
| word count | 294912 words | 294912 words | 262144 words | 294912 words | 262144 words | 262144 words | 262144 words | 294912 words |
| character code | 288000 | 288000 | 256000 | 288000 | 256000 | 256000 | 256000 | 288000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 288KX32 | 288KX32 | 256KX32 | 288KX32 | 256KX32 | 256KX32 | 256KX32 | 288KX32 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK | FLATPACK |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V |
| Minimum supply voltage (Vsup) | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | MOS | MOS | MOS | MOS | MOS | MOS | MOS | MOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | J BEND | J BEND | GULL WING | GULL WING | J BEND | J BEND | GULL WING | GULL WING |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| Maker | SIEMENS | SIEMENS | SIEMENS | - | - | SIEMENS | SIEMENS | SIEMENS |
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