5962R0052101TXC datasheet, PDF

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5962R0052101TXC: DescriptionBUF OR INV BASED MOSFET DRIVER, CDFP16, CERAMIC, DFP-16; CategoryAnalog mixed-signal IC Drivers and interfaces; File Size149KB，23 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/

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5962R0052101TXC Overview

BUF OR INV BASED MOSFET DRIVER, CDFP16, CERAMIC, DFP-16

5962R0052101TXC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Renesas Electronics Corporation
Parts packaging code	DFP
package instruction	DFP, FL16,.3
Contacts	16
Reach Compliance Code	compliant
ECCN code	EAR99
high side driver	YES
Interface integrated circuit type	BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 code	R-CDFP-F16
JESD-609 code	e4
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	10/18 V
Certification status	Not Qualified
Filter level	MIL-PRF-38535 Class T
Maximum seat height	2.92 mm
Maximum supply voltage	18 V
Minimum supply voltage	10 V
surface mount	YES
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
total dose	100k Rad(Si) V
width	6.73 mm
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Make changes to t

, T

, V

PAUX

, t

, T

tests and switch footnotes 2 and 3

as specified under table I. - ro

DATE (YR-MO-DA)

00-08-21

APPROVED

R. MONNIN

Make changes to SEP as specified under 1.5 and I

CCS

, t

tests as

specified in table I. – ro

00-09-20

R. MONNIN

Make correction to PWR pin description as specified in figure 1. - ro

01-12-14

R. MONNIN

Make changes to UV- in table I, added footnote to 1.5 and table I. - gt

03-06-19

R. MONNIN

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

RICK OFFICER

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

RAJESH PITHADIA

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216

http://www.dscc.dla.mil

APPROVED BY

RAYMOND MONNIN

DRAWING APPROVAL DATE

00-07-26

MICROCIRCUIT, DIGITAL-LINEAR, RADIATION

HARDENED, COMPLEMENTARY SWITCH FET

DRIVER, MONOLITHIC SILICON

AMSC N/A

REVISION LEVEL

SIZE

SHEET

CAGE CODE

67268

1 OF

5962-00521

DSCC FORM 2233

APR 97

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E446-03

HANDBOOKS

DEPARTMENT OF DEFENSE

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization

Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q, T and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q, T and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 2.

3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the

full ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space

limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the

RHA designator shall still be marked. Marking for device classes Q, T and V shall be in accordance with MIL-PRF-38535.

Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.

3.5.1 Certification/compliance mark. The certification mark for device classes Q, T and V shall be a "QML" or "Q" as

required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,

appendix A.

3.6 Certificate of compliance. For device classes Q, T and V, a certificate of compliance shall be required from a

QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a

certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-

HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of

supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q, T and V, the requirements of

MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43216-5000

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-00521

SHEET

5962R0052101TXC Related Products

	5962R0052101TXC	5962F0052101V9A	5962F0052101VXC	5962F0052101QXC
Description	BUF OR INV BASED MOSFET DRIVER, CDFP16, CERAMIC, DFP-16	BUF OR INV BASED MOSFET DRIVER, UUC16, 0.129 X 0.174 INCH, 0.190 INCH HEIGHT, DIE-16	3A BUF OR INV BASED MOSFET DRIVER, CDFP16, CERAMIC, DFP-16	3A BUF OR INV BASED MOSFET DRIVER, CDFP16, CERAMIC, DFP-16
Maker	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Parts packaging code	DFP	DIE	DFP	DFP
package instruction	DFP, FL16,.3	DIE, DIE OR CHIP	DFP, FL16,.3	DFP, FL16,.3
Contacts	16	16	16	16
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	USML XV(E)	EAR99
high side driver	YES	YES	YES	YES
Interface integrated circuit type	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER	BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 code	R-CDFP-F16	R-XUUC-N16	R-CDFP-F16	R-CDFP-F16
Number of functions	1	1	1	1
Number of terminals	16	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DFP	DIE	DFP	DFP
Encapsulate equivalent code	FL16,.3	DIE OR CHIP	FL16,.3	FL16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	UNCASED CHIP	FLATPACK	FLATPACK
power supply	10/18 V	10/18 V	10/18 V	10/18 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	MIL-PRF-38535 Class T	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	MIL-PRF-38535 Class Q
Maximum supply voltage	18 V	18 V	18 V	18 V
Minimum supply voltage	10 V	10 V	10 V	10 V
surface mount	YES	YES	YES	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	NO LEAD	FLAT	FLAT
Terminal location	DUAL	UPPER	DUAL	DUAL
total dose	100k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V
Is it lead-free?	Contains lead	Contains lead	Lead free	-
Is it Rohs certified?	incompatible	incompatible	incompatible	-
JESD-609 code	e4	-	e4	e4
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
Maximum seat height	2.92 mm	-	2.92 mm	2.92 mm
Terminal surface	GOLD	-	GOLD	GOLD
Terminal pitch	1.27 mm	-	1.27 mm	1.27 mm
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	6.73 mm	-	6.73 mm	6.73 mm
Base Number Matches	1	1	1	-

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