1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 – CDLL5956)
Available
Metallurgically Bonded Glass Surface Mount
1.5 Watt Zener Diodes
DESCRIPTION
Screening in
reference to
MIL-PRF-19500
available
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB package is similar
in electrical features to the JEDEC registered 1N5913B through 1N5956B axial-leaded
package for 3.3 to 200 V. It is an ideal selection for applications of high density and low
parasitic requirements. Due to its glass hermetic qualities and metallurgically enhanced
internal contacts, it may also be used for high reliability applications when required by a source
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as described in
Features below.
Important:
For the latest information, visit our website
http://www.microsemi.com.
DO-213AB MELF
Package
Also available in:
DO-41 package
(glass axial-leaded)
1N5913BG – 1N5956BG
FEATURES
•
•
•
•
•
Surface mount equivalent of JEDEC registered 1N5913B TO 1N5956B number series.
Zener voltage available 3.3 V to 200 V.
Voltage tolerances of 10%, 5%, 2% and 1% are available.
Screening in reference to MIL-PRF-19500 is available.
(See
part nomenclature
for all available options.)
RoHS compliant versions are available.
SMB package
(tabbed surface mount)
SMBG(J)5913B –
SMBG(J)5956B
SMAJ package
APPLICATIONS / BENEFITS
•
•
•
•
•
•
•
Regulates voltage over a broad ranges of operation current and temperature.
Leadless package ideal for high-density surface mounting.
Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance.
Hermetically sealed glass package.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Specified capacitance (see
figure 2).
Inherently radiation hard as described in Microsemi
MicroNote 050.
o
(tabbed surface mount)
SMAJ5913B –
SMAJ5956B
Powermite package
(tabbed surface mount)
1PMT5913B –
1PMT5956B
MAXIMUM RATINGS
@ T
A
= 25 C unless otherwise specified
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-End Cap
(1)
Thermal Resistance Junction-to-Ambient
Steady State Power Dissipation
@ T
EC
≤ 115 ºC
(1)
@ T
A
= 25 ºC
Rated Average Power Dissipation (also see
figure 1)
Forward Voltage
@ 200 mA
Solder Temperature @ 10 s
Symbol
T
J
& T
STG
R
ӨJEC
R
ӨJA
P
D
P
M(AV)
V
F
T
SP
Value
-65 to +175
40
120
1.5
1.25
1.5
1.2
260
Unit
o
C
o
C/W
o
C/W
W
W
V
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
T4-LDS-0300-1, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 1 of 5
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 – CDLL5956)
MECHANICAL and PACKAGING
•
•
•
•
•
•
•
CASE: Hermetically sealed voidless hard glass with tungsten slugs.
TERMINALS: Tin/lead or RoHS compliant matte/tin plating over copper. Solderable per MIL-STD-750, method 2026.
MARKING: Cathode band only.
POLARITY: Cathode indicated by band. Diode to be operated with the banded end positive with respect to the opposite end for
Zener regulation.
TAPE & REEL option: Standard per EIA-481-B with 12mm tape (add TR suffix to part number). Consult factory for quantities.
WEIGHT: Approximately 0.05 grams.
See
package dimensions
on last page.
PART NOMENCLATURE
MQ
Reliability Level
MQ
MX
MV
MSP
Blank = Commercial
*(refer to
MicroNote 129)
JEDEC type number
(See
Electrical Characteristics
table)
1N5913 B
UR
-1 (e3)
RoHS Compliance
e3 = RoHS compliant
Blank = non-RoHS compliant
Metallurgically Bonded
MELF Surface Mount
Tolerance Level
A = 10 %
B=5%
C=2%
D = 1%
Symbol
V
Z
I
Z
, I
ZT
, I
ZK
Z
ZT
or Z
ZK
V
F
I
R
I
ZM
SYMBOLS & DEFINITIONS
Definition
Zener Voltage: The Zener voltage the device will exhibit at a specified current (I
Z
) in its breakdown region.
Regulator Current: The dc regulator current (I
Z
), at a specified test point (I
ZT
), near breakdown knee (I
ZK
).
Regulator Impedance: The small signal impedance of the diode when biased to operate in its breakdown region with
I
ZT
applied at I
Z
or I
ZK
respectively. This has also been known as Zener or dynamic impedance (Z
ZT
or Z
ZK
).
Forward Voltage: The positive dc anode-cathode voltage the device will exhibit at a specified forward current.
Reverse Current: The dc current flowing from the external circuit into the cathode terminal at the specified voltage V
R
.
Maximum Regulator (Zener) Current: The maximum rated dc current for the specified power rating.
T4-LDS-0300-1, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 2 of 5
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 – CDLL5956)
ELECTRICAL CHARACTERISTICS
@ T
EC
= 25 ºC unless otherwise noted
DYNAMIC
ZENER
TEST
KNEE
IMPEDANCE
VOLTAGE
CURRENT
CURRENT
PART
Z
ZT
V
Z
I
ZT
I
ZK
NUMBER
(Note 1)
(Note 2)
(Note 3)
Volts
mA
Ohms
mA
1N5913BUR-1
3.3
113.6
10
1.0
1N5914BUR-1
3.6
104.2
9.0
1.0
1N5915BUR-1
3.9
96.1
7.5
1.0
1N5916BUR-1
4.3
87.2
6.0
1.0
1N5917BUR-1
4.7
79.8
5.0
1.0
1N5918BUR-1
5.1
73.5
4.0
1.0
1N5919BUR-1
5.6
66.9
2.0
1.0
1N5920BUR-1
6.2
60.5
2.0
1.0
1N5921BUR-1
6.8
55.1
2.5
1.0
1N5922BUR-1
7.5
50.0
3.0
0.5
1N5923BUR-1
8.2
45.7
3.5
0.5
1N5924BUR-1
9.1
41.2
4.0
0.5
1N5925BUR-1
10
37.5
4.5
0.25
1N5926BUR-1
11
34.1
5.5
0.25
1N5927BUR-1
12
31.2
6.5
0.25
1N5928BUR-1
13
28.8
7.0
0.25
1N5929BUR-1
15
25.0
9.0
0.25
1N5930BUR-1
16
23.4
10
0.25
1N5931BUR-1
18
20.8
12
0.25
1N5932BUR-1
20
18.7
14
0.25
1N5933BUR-1
22
17.0
17.5
0.25
1N5934BUR-1
24
15.6
19
0.25
1N5935BUR-1
27
13.9
23
0.25
1N5936BUR-1
30
12.5
28
0.25
1N5937BUR-1
33
11.4
33
0.25
1N5938BUR-1
36
10.4
38
0.25
1N5939BUR-1
39
9.6
45
0.25
1N5940BUR-1
43
8.7
53
0.25
1N5941BUR-1
47
8.0
67
0.25
1N5942BUR-1
51
7.3
70
0.25
1N5943BUR-1
56
6.7
86
0.25
1N5944BUR-1
62
6.0
100
0.25
1N5945BUR-1
68
5.5
120
0.25
1N5946BUR-1
75
5.0
140
0.25
1N5947BUR-1
82
4.6
160
0.25
1N5948BUR-1
91
4.1
200
0.25
1N5949BUR-1
100
3.7
250
0.25
1N5950BUR-1
110
3.4
300
0.25
1N5951BUR-1
120
3.1
380
0.25
1N5952BUR-1
130
2.9
450
0.25
1N5953BUR-1
150
2.5
600
0.25
1N5954BUR-1
160
2.3
700
0.25
1N5955BUR-1
180
2.1
900
0.25
1N5956BUR-1
200
1.9
1200
0.25
o
* T
EC
Maintained at 30 C, V
F
= 1.2 V max @ I
F
= 200 mA (all types).
KNEE
IMPEDANCE
Z
ZK
(Note 2)
Ohms
500
500
500
500
500
350
250
200
200
400
400
500
500
550
550
550
600
600
650
650
650
700
700
750
800
850
900
950
1000
1100
1300
1500
1700
2000
2500
3000
3100
4000
4500
5000
6000
6500
7000
8000
REVERSE
CURRENT
I
R
µA
100
75
25
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
5.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
REVERSE
VOLTAGE
V
R
Volts
1.0
1.0
1.0
1.0
1.5
2.0
3.0
4.0
5.2
6.0
6.5
7.0
8.0
8.4
9.1
9.9
11.4
12.2
13.7
15.2
16.7
18.2
20.6
22.8
25.1
27.4
29.7
32.7
35.8
38.8
42.6
47.1
51.2
56.0
62.2
69.2
76.0
83.6
91.2
98.9
114.0
121.6
136.8
152.0
MAX. DC
CURRENT
I
ZM
mA
454
416
384
348
319
294
267
241
220
200
182
164
150
136
125
115
100
93
83
75
68
62
55
50
45
41
38
34
31
29
26
24
22
20
18
16
15
13
12
11
10
9
8
7
NOTES:
1. Zener voltage (V
Z
) is measured at end cap temperatures T
EC
= 30
o
C. Voltage measurement to be performed 90 seconds after
application of dc current.
2.
The Zener impedance is derived from the 60 Hz ac voltage, which results when an ac current having an rms value equal to
10% of the dc Zener current (I
ZT
or I
ZK
) is superimposed on I
ZT
or I
ZK
.
This product series has also been previously identified as the CDLL5913B through CDLL5956B series that included the
enhanced metallurgical bond. This alternate name may still be used.
3.
T4-LDS-0300-1, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 3 of 5
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 – CDLL5956)
GRAPHS
P
D
, Maximum Power Dissipation (Watts)
Temperature ( C)
T
EC
End Cap temp (ºC), or T
A
on FR4 PC Board
o
FIGURE 1 –
Power Derating Curve
C – Capacitance - Picofarads
V
Z
– Zener Voltage – Volts
FIGURE 2 –
Capacitance vs Zener Voltage
T4-LDS-0300-1, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 4 of 5
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 – CDLL5956)
PACKAGE DIMENSIONS
Symbol
BD
BL
ECT
S
Dimensions
Inch
Millimeters
Min
Max
Min
Max
0.094
0.105
2.39
2.67
0.189
0.205
4.80
5.21
0.014
0.022
0.360 0.560
0.001 min
0.03 min
NOTES:
1. Dimensions are in inches. Millimeters are given for general information only.
2. Gap not controlled, shape of body and gap not controlled.
3. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
PAD LAYOUT
Ltr
A
B
C
Inch
0.276
0.070
0.110
mm
7.00
1.8
2.8
T4-LDS-0300-1, Rev. 1 (6/6/13)
©2013 Microsemi Corporation
Page 5 of 5
Embedded System
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