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5962-8873303XC

Description
Multiplier Accumulator/Summer, 16-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size246KB,7 Pages
ManufacturerLOGIC Devices
Websitehttp://www.logicdevices.com/
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5962-8873303XC Overview

Multiplier Accumulator/Summer, 16-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64

5962-8873303XC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeDIP
package instructionDIP, DIP64,.9
Contacts64
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Other features2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
boundary scanNO
External data bus width16
JESD-30 codeR-CDIP-T64
JESD-609 codee4
length81.28 mm
low power modeNO
Humidity sensitivity level3
Number of terminals64
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Output data bus width35
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP64,.9
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height3.81 mm
Maximum slew rate25 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width22.86 mm
uPs/uCs/peripheral integrated circuit typeDSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches1

5962-8873303XC Related Products

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Description Multiplier Accumulator/Summer, 16-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64 Multiplier Accumulator/Summer, 16-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64 Multiplier Accumulator/Summer, 16-Bit, CMOS, CPGA68, CAVITY-DOWN, CERAMIC, PGA-68 Multiplier Accumulator/Summer, 16-Bit, CMOS, CPGA68, CAVITY-DOWN, CERAMIC, PGA-68 Multiplier Accumulator/Summer, 16-Bit, CMOS, CPGA68, CAVITY-DOWN, CERAMIC, PGA-68 Multiplier Accumulator/Summer, 16-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68 Multiplier Accumulator/Summer, 16-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68 Multiplier Accumulator/Summer, 16-Bit, CMOS, CDIP64, 0.900 INCH, CAVITY DOWN, HERMETIC SEALED, SIDE BRAZED, DIP-64 Multiplier Accumulator/Summer, 16-Bit, CMOS, CQCC68, 0.950 X 0.950 INCH, CERAMIC, LCC-68
Parts packaging code DIP DIP PGA PGA PGA LCC LCC DIP LCC
package instruction DIP, DIP64,.9 DIP, DIP64,.9 PGA, PGA, PGA, PGA68,11X11 QCCN, LCC68,.95SQ QCCN, LCC68,.95SQ DIP, DIP64,.9 QCCN, LCC68,.95SQ
Contacts 64 64 68 68 68 68 68 64 68
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
Other features 2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ 2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ 2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ 2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ 2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ 2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ 2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ 2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ 2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
boundary scan NO NO NO NO NO NO NO NO NO
External data bus width 16 16 16 16 16 16 16 16 16
JESD-30 code R-CDIP-T64 R-CDIP-T64 S-CPGA-P68 S-CPGA-P68 S-CPGA-P68 S-CQCC-N68 S-CQCC-N68 R-CDIP-T64 S-CQCC-N68
JESD-609 code e4 e4 e4 e4 e4 e4 e4 e4 e4
length 81.28 mm 81.28 mm 29.4386 mm 29.4386 mm 29.4386 mm 24.1935 mm 24.1935 mm 81.28 mm 24.1935 mm
low power mode NO NO NO NO NO NO NO NO NO
Number of terminals 64 64 68 68 68 68 68 64 68
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Output data bus width 35 35 35 35 35 35 35 35 35
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP PGA PGA PGA QCCN QCCN DIP QCCN
Package shape RECTANGULAR RECTANGULAR SQUARE SQUARE SQUARE SQUARE SQUARE RECTANGULAR SQUARE
Package form IN-LINE IN-LINE GRID ARRAY GRID ARRAY GRID ARRAY CHIP CARRIER CHIP CARRIER IN-LINE CHIP CARRIER
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 3.81 mm 3.81 mm 3.81 mm 3.81 mm 3.81 mm 3.048 mm 3.048 mm 3.81 mm 3.048 mm
Maximum slew rate 25 mA 25 mA 25 mA 25 mA 25 mA 25 mA 25 mA 25 mA 25 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO YES YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface GOLD GOLD GOLD GOLD Gold (Au) Gold (Au) GOLD Gold (Au) Gold (Au)
Terminal form THROUGH-HOLE THROUGH-HOLE PIN/PEG PIN/PEG PIN/PEG NO LEAD NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL PERPENDICULAR PERPENDICULAR PERPENDICULAR QUAD QUAD DUAL QUAD
width 22.86 mm 22.86 mm 29.4386 mm 29.4386 mm 29.4386 mm 24.1935 mm 24.1935 mm 22.86 mm 24.1935 mm
uPs/uCs/peripheral integrated circuit type DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches 1 1 1 1 1 1 1 1 1
Is it Rohs certified? incompatible incompatible - - incompatible incompatible incompatible incompatible incompatible
Humidity sensitivity level 3 3 - - 3 3 3 3 3
Encapsulate equivalent code DIP64,.9 DIP64,.9 - - PGA68,11X11 LCC68,.95SQ LCC68,.95SQ DIP64,.9 LCC68,.95SQ
power supply 5 V 5 V - - 5 V 5 V 5 V 5 V 5 V
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B - - 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
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