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89HPES24T3G2ZCALI

Description
FCBGA-324, Tray
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size651KB,51 Pages
ManufacturerIDT (Integrated Device Technology)
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89HPES24T3G2ZCALI Overview

FCBGA-324, Tray

89HPES24T3G2ZCALI Parametric

Parameter NameAttribute value
Brand NameIntegrated Device Technology
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Parts packaging codeFCBGA
package instructionFCBGA-324
Contacts324
Manufacturer packaging codeAL324
Reach Compliance Codenot_compliant
ECCN codeEAR99
Address bus width
Bus compatibilityPCI
maximum clock frequency125 MHz
External data bus width
JESD-30 codeS-PBGA-B324
JESD-609 codee0
length19 mm
Humidity sensitivity level4
Number of terminals324
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA324,18X18,40
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)225
power supply1,2.5,3.3 V
Certification statusNot Qualified
Maximum seat height3.42 mm
Maximum supply voltage1.1 V
Minimum supply voltage0.9 V
Nominal supply voltage1 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn63Pb37)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width19 mm
uPs/uCs/peripheral integrated circuit typeBUS CONTROLLER, PCI
Base Number Matches1
24-Lane 3-Port
Gen2 PCI Express® Switch
®
89HPES24T3G2
Datasheet
The 89HPES24T3G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES24T3G2 is a 24-lane, 3-port
Gen2 peripheral chip that performs PCI Express base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications systems. It provides connectivity and
switching functions between a PCI Express upstream port and two
downstream ports and supports switching between downstream ports.
Device Overview
Features
u
u
High Performance PCI Express Switch
– Twenty-four 5 Gbps Gen2 PCI Express lanes supporting
5 Gbps and 2.5 Gbps operation
– Up to three switch ports
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– Fully compliant with PCI Express base specification Revision
2.0
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2, or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
u
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
u
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 5 Gbps / 2.5 Gbps embedded SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
u
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
3-Port Switch Core / 24 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
...
...
...
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 50
December 16, 2013
DSC 6930

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Description FCBGA-324, Tray FCBGA-324, Reel FCBGA-324, Tray FCBGA-324, Tray FCBGA-676, Reel FCBGA-676, Reel FCBGA-676, Tray FCBGA-324, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
Is it lead-free? Contains lead Lead free Lead free Lead free Lead free Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible conform to conform to conform to conform to incompatible incompatible incompatible
Parts packaging code FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA
package instruction FCBGA-324 FCBGA-324 FCBGA-324 FCBGA-324 FCBGA-676 BGA, 27 X 27 MM, 1 MM PITCH, FCBGA-676 FCBGA-324
Contacts 324 324 324 324 676 676 676 324
Manufacturer packaging code AL324 ALG324 ALG324 ALG324 BLG676 BL676 BL676 AL324
Reach Compliance Code not_compliant compliant compliant compliant compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Bus compatibility PCI SMBUS PCI; SMBUS PCI SMBUS SMBUS PCI PCI
JESD-30 code S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B676 S-PBGA-B676 S-PBGA-B676 S-PBGA-B324
JESD-609 code e0 e1 e1 e1 e1 e0 e0 e0
length 19 mm 19 mm 19 mm 19 mm 27 mm 27 mm 27 mm 19 mm
Humidity sensitivity level 4 4 4 4 4 4 4 4
Number of terminals 324 324 324 324 676 676 676 324
Maximum operating temperature 85 °C 70 °C 85 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Celsius) 225 260 260 260 245 225 225 225
Maximum seat height 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.22 mm 3.22 mm 3.22 mm 3.42 mm
Maximum supply voltage 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
Minimum supply voltage 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
Nominal supply voltage 1 V 1 V 1 V 1 V 1 V 1 V 1 V 1 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn63Pb37)
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30
width 19 mm 19 mm 19 mm 19 mm 27 mm 27 mm 27 mm 19 mm
uPs/uCs/peripheral integrated circuit type BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 1 1 1 1
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - - - IDT (Integrated Device Technology)
maximum clock frequency 125 MHz - 100 MHz 125 MHz - - 125 MHz 125 MHz
Other features - HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. - ALSO REQUIRES 3.3V SUPPLY HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. HAVING 125MHZ INPUT REFERENCE CLOCK FREQUENCY. ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY

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