EEWORLDEEWORLDEEWORLD

Part Number

Search

A40MX02-PQG100IX39

Description
Field Programmable Gate Array, 295-Cell, CMOS, PQFP100,
CategoryProgrammable logic devices    Programmable logic   
File Size3MB,117 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
Download Datasheet Parametric View All

A40MX02-PQG100IX39 Overview

Field Programmable Gate Array, 295-Cell, CMOS, PQFP100,

A40MX02-PQG100IX39 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
package instructionQFP, QFP100,.7X.9
Reach Compliance Codecompliant
JESD-30 codeR-PQFP-G100
Humidity sensitivity level3
Number of entries57
Number of logical units295
Output times57
Number of terminals100
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP100,.7X.9
Package shapeRECTANGULAR
Package formFLATPACK
power supply3.3/5 V
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.635 mm
Terminal locationQUAD
Base Number Matches1
v6.0
40MX and 42MX FPGA Families
Fe a t ur es
High C apaci t y
Single-Chip ASIC Alternative
3,000 to 54,000 System Gates
Up to 2.5 kbits Configurable Dual-Port SRAM
Fast Wide-Decode Circuitry
Up to 202 User-Programmable I/O Pins
5.6 ns Clock-to-Out
250 MHz Performance
5 ns Dual-Port SRAM Access
100 MHz FIFOs
7.5 ns 35-Bit Address Decode
• Commercial, Military Temperature, and MIL-STD-883
Ceramic Packages
• QML Certification
• Ceramic Devices Available to DSCC SMD
E ase of Int egr at io n
High P er f or m ance
• Mixed-Voltage Operation (5.0V or 3.3V for core and I/Os),
with PCI-Compliant I/Os
• Up to 100% Resource Utilization and 100% Pin Locking
• Deterministic, User-Controllable Timing
• Unique In-System Diagnostic and Verification Capability
with Silicon Explorer II
• Low Power Consumption
• IEEE Standard 1149.1 (JTAG) Boundary Scan Testing
HiR el Feat ur es
• Commercial, Industrial, Automotive, and Military
Temperature Plastic Packages
Pr od uc t P r o f i l e
Device
Capacity
System Gates
SRAM Bits
Logic Modules
Sequential
Combinatorial
Decode
Clock-to-Out
SRAM Modules
(64x4 or 32x8)
Dedicated Flip-Flops
Maximum Flip-Flops
Clocks
User I/O (maximum)
PCI
Boundary Scan Test (BST)
Packages (by pin count)
)
PLCC
PQFP
VQFP
TQFP
CQFP
PBGA
A40MX02
3,000
295
9.5 ns
147
1
57
44, 68
100
80
A40MX04
6,000
547
9.5 ns
273
1
69
44, 68, 84
100
80
A42MX09
14,000
348
336
5.6 ns
348
516
2
104
84
100, 160
100
176
A42MX16
24,000
624
608
6.1 ns
624
928
2
140
84
100, 160, 208
100
176
A42MX24
36,000
954
912
24
6.1 ns
954
1,410
2
176
Yes
Yes
84
160, 208
176
A42MX36
54,000
2,560
1,230
1,184
24
6.3 ns
10
1,230
1,822
6
202
Yes
Yes
208, 240
208, 256
272
J an u a r y 2 0 0 4
1
© 2004 Actel Corporation

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 706  549  968  2611  2669  15  12  20  53  54 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号