TP3321J datasheet, PDF - EEWORLD Datasheet

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TP3321J: DescriptionIC 1.2 kbps DATA, MODEM, CDIP20, CERDIP-20, Modem; CategoryWireless rf/communication Telecom circuit; File Size743KB，11 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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TP3321J Overview

IC 1.2 kbps DATA, MODEM, CDIP20, CERDIP-20, Modem

TP3321J Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknown
Other features	HALF DUPLEX; FULL DUPLEX
data rate	1.2 Mbps
JESD-30 code	R-GDIP-T20
JESD-609 code	e0
length	24.51 mm
Negative supply voltage rating	-5 V
Number of functions	1
Number of terminals	20
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.08 mm
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Telecom integrated circuit types	MODEM
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

TP3321J Related Products

	TP3321J	TP3320J	TP3321J/A+
Description	IC 1.2 kbps DATA, MODEM, CDIP20, CERDIP-20, Modem	IC 1.2 kbps DATA, MODEM, CDIP20, CERDIP-20, Modem	IC,MODEM CIRCUIT,MODEM,CMOS,DIP,20PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3
Reach Compliance Code	unknown	unknown	unknown
JESD-30 code	R-GDIP-T20	R-GDIP-T20	R-XDIP-T20
JESD-609 code	e0	e0	e0
Number of terminals	20	20	20
Maximum operating temperature	70 °C	70 °C	70 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC
encapsulated code	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE
surface mount	NO	NO	NO
technology	CMOS	CMOS	CMOS
Telecom integrated circuit types	MODEM	MODEM	MODEM
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL
Other features	HALF DUPLEX; FULL DUPLEX	HALF DUPLEX; FULL DUPLEX	-
data rate	1.2 Mbps	1.2 Mbps	-
length	24.51 mm	24.51 mm	-
Negative supply voltage rating	-5 V	-5 V	-
Number of functions	1	1	-
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-
Certification status	Not Qualified	Not Qualified	-
Maximum seat height	5.08 mm	5.08 mm	-
Nominal supply voltage	5 V	5 V	-
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-
width	7.62 mm	7.62 mm	-
Base Number Matches	1	1	-

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