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HCTS27D/SAMPLE

Description
NOR Gate, HCT Series, 3-Func, 3-Input, CMOS, CDIP14
Categorylogic    logic   
File Size220KB,8 Pages
ManufacturerHarris
Websitehttp://www.harris.com/
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HCTS27D/SAMPLE Overview

NOR Gate, HCT Series, 3-Func, 3-Input, CMOS, CDIP14

HCTS27D/SAMPLE Parametric

Parameter NameAttribute value
MakerHarris
package instruction,
Reach Compliance Codeunknown
seriesHCT
JESD-30 codeR-CDIP-T14
Load capacitance (CL)50 pF
Logic integrated circuit typeNOR GATE
Number of functions3
Number of entries3
Number of terminals14
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeRECTANGULAR
Package formIN-LINE
propagation delay (tpd)20 ns
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Base Number Matches1

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Description NOR Gate, HCT Series, 3-Func, 3-Input, CMOS, CDIP14 NOR Gate, HCT Series, 3-Func, 3-Input, CMOS, CDFP14 NOR Gate, HCT Series, 3-Func, 3-Input, CMOS, CDIP14 NOR Gate, HCT Series, 3-Func, 3-Input, CMOS NOR Gate, HCT Series, 3-Func, 3-Input, CMOS, CDIP14 NOR Gate, HCT Series, 3-Func, 3-Input, CMOS, CDFP14 NOR Gate, HCT Series, 3-Func, 3-Input, CMOS
package instruction , DFP, FL14,.3 , DIE, DIP, DIP14,.3 , DIE,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
series HCT HCT HCT HCT HCT HCT HCT
JESD-30 code R-CDIP-T14 R-CDFP-F14 R-CDIP-T14 X-XUUC-N14 R-CDIP-T14 R-CDFP-F14 X-XUUC-N14
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE NOR GATE
Number of functions 3 3 3 3 3 3 3
Number of entries 3 3 3 3 3 3 3
Number of terminals 14 14 14 14 14 14 14
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package shape RECTANGULAR RECTANGULAR RECTANGULAR UNSPECIFIED RECTANGULAR RECTANGULAR UNSPECIFIED
Package form IN-LINE FLATPACK IN-LINE UNCASED CHIP IN-LINE FLATPACK UNCASED CHIP
propagation delay (tpd) 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns 20 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO YES NO YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form THROUGH-HOLE FLAT THROUGH-HOLE NO LEAD THROUGH-HOLE FLAT NO LEAD
Terminal location DUAL DUAL DUAL UPPER DUAL DUAL UPPER
Maker Harris Harris - Harris Harris Harris Harris
Base Number Matches 1 1 1 1 1 1 -
JESD-609 code - e0 e4 e0 e0 - -
Maximum operating temperature - 125 °C 125 °C 125 °C 125 °C - 125 °C
Minimum operating temperature - -55 °C -55 °C -55 °C -55 °C - -55 °C
encapsulated code - DFP - DIE DIP - DIE
Temperature level - MILITARY MILITARY MILITARY MILITARY - MILITARY
Terminal surface - Tin/Lead (Sn/Pb) GOLD TIN LEAD Tin/Lead (Sn/Pb) - -
total dose - 200k Rad(Si) V 100k Rad(Si) V 100k Rad(Si) V 200k Rad(Si) V - -
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