BZX55C2V0-
BZX55C75
SILICON PLANAR ZENER DIODE
FEATURES
* Zener Voltage Range 2.0 to 75 Volts
* DO-35 Package (JEDEC)
* Through-Hole Device Type Mounting
* Hermetically Sealed Glass
* Compression Bonded Construction
* All external surfaces are corrosion resistant and leads
are readily solderable
.022 (0.56)
DIA.
.018 (0.46)
1.02 (26.0)
MIN.
DO-35
.165 (4.2)
MAX.
.079 (2.0)
MAX.
1.02 (26.0)
MIN.
DIA.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
o
Dimensions in inches and (millimeters)
MAXIMUM RATINGES
( @ T
A
= 25
o
C unless otherwise noted )
RATINGS
Power Dissipation
Junction Temperature
Storage Temperature Range
Note: "Fully RoHS Compliant", "100% Sn Plating (Pb-free)".
SYMBOL
P
D
T
J
Tstg
VALUE
500
200
-65to+200
UNITS
mW
O
C
C
O
VB 2007-4
ELECTRICAL CHARACTERISTICS
VZT@IZT
TYPE
MIN
BZX55C2V0
BZX55C2V2
BZX55C2V4
BZX55C2V7
BZX55C3V0
BZX55C3V3
BZX55C3V6
BZX55C3V9
BZX55C4V3
BZX55C4V7
BZX55C5V1
BZX55C5V6
BZX55C6V2
BZX55C6V8
BZX55C7V5
BZX55C8V2
BZX55C9V1
BZX55C10
BZX55C11
BZX55C12
BZX55C13
BZX55C15
BZX55C16
BZX55C18
BZX55C20
BZX55C22
BZX55C24
BZX55C27
BZX55C30
BZX55C33
BZX55C36
BZX55C39
1.88
2.08
2.28
2.51
2.8
3.1
3.4
3.7
4.0
4.4
4.8
5.2
5.8
6.4
7.0
7.7
8.5
9.4
10.4
11.4
12.4
13.8
15.3
16.8
18.8
20.8
22.8
25.1
28
31
34
37
(@TA=25 C unless otherwise specified)
O
ZZT@IZT
ZZT@IZT
IR@VR
(Volts)
MAX
2.11
2.33
2.56
2.89
3.2
3.5
3.8
4.1
4.6
5.0
5.4
6.0
6.6
7.2
7.9
8.7
9.6
10.6
11.6
12.7
14.1
15.6
17.1
19.1
21.1
23.3
25.6
28.9
32
35
38
41
(mA)
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
IZT
(W)
MAX
100
100
85
85
85
85
85
85
75
60
35
25
10
8
7
7
10
15
20
20
26
30
40
50
55
55
80
80
80
80
80
90
(mA)
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0.5
IZT
(W)
MAX
600
600
600
600
600
600
600
600
600
600
550
450
200
150
50
50
50
70
70
90
110
110
170
170
220
220
220
220
220
220
220
500
(uA)
MAX
100
100
50
10
4
2
2
2
1
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
(Volts)
1
1
1
1
1
1
1
1
1
1
1
1
2
3
5
6.2
6.8
7.5
8.2
9.1
10
11
12
13
15
16
18
20
22
24
27
28
VR
ELECTRICAL CHARACTERISTICS
VZT@IZT
TYPE
MIN
BZX55C43
BZX55C47
BZX55C51
BZX55C56
BZX55C62
BZX55C68
BZX55C75
40
44
48
52
58
64
70
(@TA=25 C unless otherwise specified)
O
ZZT@IZT
ZZT@IZT
IR@VR
(Volts)
MAX
46
50
54
60
66
72
80
(mA)
2.5
2.5
2.5
2.5
2.5
2.5
2.5
IZT
(W)
MAX
90
110
125
135
150
160
170
(mA)
0.5
0.5
0.5
0.5
0.5
0.5
0.5
IZT
(W)
MAX
600
700
700
1000
1000
1000
1000
(uA)
MAX
0.1
0.1
0.1
0.1
0.1
0.1
0.1
(Volts)
32
35
38
42
47
51
56
VR
RATING AND CHARACTERISTICS CURVES ( BZX55C2V0-BZX55C75)
R
qJA
,THERMAL RESISTANCE JUNCTION TO AMBIENT(K/W)
PD, TOTAL POWER DISSIPATION (mW)
500
400
300
200
100
0
500
400
300
200
100
0
0
40
80
120
160
200
0
5
10
I,LEAD LENGTH(mm)
15
20
TA, AMBIENT TEMPERATURE
Figure1 Power Dissipation vs Ambient Temperature
DIFFERENTIAL ZENER RESISTANCE(W)
Figure2 Thermal Resistance vs Lead Length
1000
T
J
=25 C
O
200
C
J
,DIODE CAPACITANCE(pF)
VR=2V
150
TJ=25 C
O
100
5mA
I
Z
=1mA
100
10
50
10mA
0
0
5
10
15
20
25
1
0
5
10
15
20
25
VZ, ZENER VOLTAGE(V)
VZ, ZENER VOLTAGE(V)
Figure3 Diode Capacitance vs Zener Voltage
Figure4 Differential Zener Impedance
DISCLAIMER NOTICE
Rectron Inc reserves the right to make changes without notice to any product
specification herein, to make corrections, modifications, enhancements or other
changes. Rectron Inc or anyone on its behalf assumes no responsibility or liabi-
lity for any errors or inaccuracies. Data sheet specifications and its information
contained are intended to provide a product description only. "Typical" paramet-
ers which may be included on RECTRON data sheets and/ or specifications ca-
n and do vary in different applications and actual performance may vary over ti-
me. Rectron Inc does not assume any liability arising out of the application or
use of any product or circuit.
Rectron products are not designed, intended or authorized for use in medical,
life-saving implant or other applications intended for life-sustaining or other rela-
ted applications where a failure or malfunction of component or circuitry may di-
rectly or indirectly cause injury or threaten a life without expressed written appr-
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