ACPL-570XL, ACPL-573XL, ACPL-177XL, 5962-08227
Hermetically Sealed 3.3V, Low I
F
, Wide V
CC
, High Gain Optocouplers
Data Sheet
Description
These devices are single, dual, and quad channel, hermeti-
cally sealed optocouplers. The products are capable of
operation and storage over the full military temperature
range and can be purchased as either standard product
or with full MIL-PRF-38534 Class Level H or K testing or
from DSCC Drawing 5962-08227. All devices are manufac-
tured and tested on a MIL-PRF-38534 certified line and are
included in the DSCC Qualified Products Database Sup-
plemental Information Sheets QPDSIS-38534 as Hybrid
Microcircuits.
Each channel contains a GaAsP light emitting diode which
is optically coupled to an integrated high gain photon
detector. The high gain output stage features an open
collector output providing both lower saturation voltage
and higher signaling speed than possible with conven-
tional photo-Darlington optocouplers.
The supply voltage can be operated as low as 3.0 V without
adversely affecting the parametric performance.
These devices have a 300% minimum CTR at an input
current of only 0.5 mA making them ideal for use in low
input current applications such as MOS, CMOS, low power
logic interfaces or line receivers.
Features
•
Low power consumption
•
3.3V Supply voltages
•
Dual marked with device part number and DSCC
drawing number
•
Manufactured and tested on a MIL-PRF-38534 Certified
Line
•
QPDSIS-38534, Class H and K
•
Three hermetically sealed package configurations
•
Performance guaranteed over full military temperature
range: -55°C to +125°C
•
Low input current requirement: 0.5 mA
•
High current transfer ratio: 1500% typical @ I
F
= 0.5 mA
•
Low output saturation voltage: 0.11 V typical
•
1500 Vdc withstand test voltage
•
HCPL-4701/31, -070A/31 function compatibility
Applications
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Military and aerospace
High reliability systems
Telephone ring detection
Microprocessor system interface
Transportation, medical, and life critical systems
Isolated input line receiver
EIA RS-232-C line receiver
Voltage level shifting
Isolated input line receiver
Isolated output line driver
Logic ground isolation
Harsh industrial environments
Current loop receiver
System test equipment isolation
Process control input/output isolation
The connection of a 0.1
µ
F bypass capacitor between V
CC
and GND is recommended.
CAUTION:
It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Functional Diagram
Multiple Channel Devices Available
1
2
3
4
8
7
6
5
Package styles for these parts are 8 and 16 pin DIP through
hole (case outlines P and E respectively). Devices may be
purchased with a variety of lead bend and plating options.
See Selection Guide table for details. Standard Military
Drawing (SMD) parts are available for each package and
lead style.
Because the same electrical die (emitters and detectors)
are used for each channel of each device listed in this
data sheet, absolute maximum ratings, recommended
operating conditions, electrical specifications, and perfor-
mance characteristics shown in the figures are similar for
all parts except as noted. Additionally, the same package
assembly processes and materials are used in all devices.
These similarities justify the use of a common data base for
die related reliability.
Truth Table
(Positive Logic)
Input
On (H)
Off (L)
Output
L
H
Selection Guide – Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
16 Pin DIP
Through Hole
4
VCC, GND
ACPL-1770L
ACPL-1772L
ACPL-177KL
Gold Plate
Option -200
Option -100
Option -300
5962-
0822703HEX
0822703HEC
0822703HEA
0822703HUC
0822703HUA
0822703HTA
5962-
0822703KEX
0822703KEC
0822703KEA
0822703KUC
0822703KUA
0822703KTA
8 Pin DIP
Through Hole
1
None
ACPL-5700L
ACPL-5701L
ACPL-570KL
Gold Plate
Option -200
Option -100
Option -300
5962-
0822701HPX
0822701HPC
0822701HPA
0822701HYC
0822701HYA
0822701HXA
5962-
0822701KPX
0822701KPC
0822701KPA
0822701KYC
0822701KYA
0822701KXA
8 Pin DIP
Through Hole
2
VCC, GND
ACPL-5730L
ACPL-5731L
ACPL-573KL
Gold Plate
Option -200
Option -100
Option -300
5962-
0822702HPX
0822702HPC
0822702HPA
0822702HYC
0822702HYA
0822702HXA
5962-
0822702KPX
0822702KPC
0822702KPA
0822702KYC
0822702KYA
0822702KXA
Avago Part # & Options
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped*
Butt Cut/Gold Plate
Gull Wing/Soldered*
Class H SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped*
Butt Cut/Gold Plate
Butt Cut/Soldered*
Gull Wing/Soldered*
Class K SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped*
Butt Cut/Gold Plate
Butt Cut/Soldered*
Gull Wing/Soldered*
* Solder contains lead.
2
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on com-
mercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
Note: Dimensions in Millimeters (Inches).
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 and
16 pin DIP. DSCC Drawing part numbers contain provisions for lead finish.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on
commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This option has solder dipped
leads.
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
300
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
Note: Dimensions in Millimeters (Inches).
Solder contains lead.
4
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Case Temperature
Junction Temperature
Lead Solder Temperature
Output Current (each channel)
Output Voltage (each channel)
Supply Voltage
Output Power Dissipation (each channel)
Peak Input Current (each channel, <1 ms duration)
Average Input Current (each channel)
Reverse Input Voltage (each channel)
Package Power Dissipation (each channel)
I
F
V
R
P
D
I
O
V
O
V
CC
-0.5
-0.5
Symbol
T
S
T
A
T
C
T
J
Min.
-65
-55
Max.
+150
+125
+170
+175
260 for 10 sec
40
20
20
50
20
10
5
200
Units
°C
°C
°C
°C
°C
mA
V
V
mW
mA
mA
V
mW
Notes
1
1
2
3
8 Pin Ceramic DIP Single Channel Schematic
2
+
–
3
5
I
O
6
I
F
V
CC
8
I
CC
ANODE
V
F
CATHODE
V
O
GND
ESD Classification
(MIL-STD-883, Method 3015)
ACPL-5700L/01L/0KL
ACPL-5730L/31L/3KL
ACPL-1770L/2L/KL
(
(
(
), Class 2
A), Class 3A
B), Class 3B
Recommended Operating Conditions
Parameter
Input Current, Low Level (Each Channel)
Input Current, High Level (Each Channel)
Supply Voltage
Output Voltage
Symbol
I
F(OFF)
I
F(ON)
V
CC
V
O
Min.
0.5
3.0
3.0
Max.
2.0
5
7.0
7.0
Units
µA
mA
V
V
5
Embedded System
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