HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9216-A
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 1/3
HTIF127
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HTIF127 is designed for use in general purpose amplifier and
low-speed switching applications.
Absolute Maximum Ratings
(Ta=25°C)
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature ................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) .................................................................................... 45 W
•
Maximum Voltages and Currents
BVCBO Collector to Base Voltage ................................................................................... -100 V
BVCEO Collector to Emitter Voltage................................................................................ -100 V
BVEBO Emitter to Base Voltage .......................................................................................... -5 V
IC Collector Current (Pulse)................................................................................................. -8 A
IC Collector Current (Continuous)........................................................................................ -5 A
IB Base Current ............................................................................................................ -120 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
*BVCEO
ICBO
ICEO
IEBO
*VCE(sat)1
*VCE(sat)2
*VBE(on)
*hFE1
*hFE2
Min.
-100
-100
-
-
-
-
-
-
1
1
Typ.
-
-
-
-
-
-
-
-
-
-
Max.
-
-
-200
-500
-2
-2
-4
-2.5
-
-
Unit
V
V
uA
uA
mA
V
V
V
K
K
Test Conditions
IC=-1mA
IC=-100mA
VCB=-100V
VCE=-50V
VEB=-5V
IC=-3A, IB=-12mA
IC=-5A, IB=-20mA
IC=-3A, VCE=-3V
IC=-0.5A, VCE=-3V
IC=-3A, VCE=-3V
*Pulse Test : Pulse Width
≤380us,
Duty Cycle≤2%
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
10000
10000
Spec. No. : HE9216-A
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 2/3
Saturation Voltage & Collector Current
Saturation Voltage (mV)
1000
hFE @ V
CE
=4V
hFE
100
1000
V
BE(sat)
@ I
C
=100I
B
V
CE(sat)
@ I
C
=100I
B
10
1
1
10
100
1000
10000
100
10
100
1000
10000
Collector Current (mA)
Collector Current (mA)
On Voltage & Collector Current
10000
10
Switching Time & Collector Current
V
CC
=30V, I
C
=250I
B1
=-250I
B2
Switching Times (us)
On Voltage (mV)
Tstg
1
Tf
Ton
1000
V
BE(on)
@ V
CE
=4V
100
1
10
100
1000
10000
0.1
1
10
Collector Current (mA)
Collector Current (A)
Capacitance & Reverse-Biased Voltage
1000
100000
Safe Operating Area
P
T
=1ms
10000
Collector Current-I
C
(mA)
P
T
=100ms
1000
P
T
=1s
100
Capacitance (pF)
100
Cob
10
10
0.1
1
10
100
1
1
10
100
Reverse-Biased Voltage (V)
Forward Voltage-V
CE
(V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220FP Dimension
A
B
Spec. No. : HE9216-A
Issued Date : 1998.07.01
Revised Date : 1999.08.01
Page No. : 3/3
Marking :
α
4
E O
C
HSMC Logo
Part Number
Date Code
Product Series
Rank
α
1
D
α
2
α
3
α
5
G
H
3
I
N
Style : Pin 1.Base 2.Collector 3.Emitter
J
F
2
K
1
M
L
3-Lead TO-220FP Plastic Package
HSMC Package Code : F
*:Typical
DIM
A
B
C
D
E
F
G
H
I
J
Inches
Min.
0.2480
0.3386
0.1673
0.1043
0.0230
0.3980
0.1083
0.3386
-
-
Max.
0.2520
0.3425
0.1870
0.1083
0.0242
0.4039
0.1122
0.3425
*0.1496
*0.0236
Millimeters
Min.
Max.
6.30
6.40
8.60
8.70
4.25
4.75
2.65
2.75
0.58
0.61
10.11
10.26
2.75
2.85
8.60
8.70
-
*3.80
-
*0.60
DIM
K
L
M
N
O
1
2
3
4
5
Inches
Min.
-
0.5118
0.5886
-
0.1098
-
-
-
-
-
Max.
*0.1004
0.5906
0.5925
*0.0669
0.1114
-2°
*5°
*15°
*5°
*5°
Millimeters
Min.
Max.
-
*2.55
13.00
15.00
14.95
15.05
-
*1.70
2.79
2.83
-
*2°
-
*5°
-
*15°
-
*5°
-
*5°
Notes :
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
•
Head Office
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
Embedded System
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