HV5308
HV5408
32-Channel Serial To Parallel Converter
With High Voltage Push-Pull Outputs
Ordering Information
Package Options
Device
44 J-Lead Quad
Ceramic Chip Carrier
HV5308DJ
HV5408DJ
44 J-Lead Quad
Plastic Chip Carrier
HV5308PJ
HV5408PJ
44 Lead Quad
Plastic Gullwing
HV5308PG
HV5408PG
Die
HV5308X
HV5408X
44 J-Lead Quad
Ceramic Chip Carrier
(MIL-STD-883 Processed*)
RBHV5308DJ
RBHV5408DJ
HV5308
HV5408
*
For Hi-Rel process flows, please refer to perfer to page 5-3 in the Databook.
Features
❏
Processed with HVCMOS
®
technology
❏
Low power level shifting
❏
Source/sink current minimum 20mA
❏
Shift register speed 8MHz
❏
Latched data outputs
❏
CMOS compatible inputs
❏
Forward and reverse shifting options
❏
Diode to V
PP
allows efficient power recovery
General Description
The HV53 and HV54 are low voltage serial to high voltage
parallel converters with push-pull outputs. These devices have
been designed for use as drivers for AC-electroluminescent
displays. They can also be used in any application requiring
multiple output high voltage current sourcing and sinking capa-
bilities such as driving plasma panels, vacuum fluorescent, or
large matrix LCD displays.
These devices consist of a 32-bit shift register, 32 latches, and
control logic to enable outputs. Q1 is connected to the first stage
of the shift register through the Output Enable logic. Data is
shifted through the shift register on the low to high transition of
the clock. The HV54 shifts in the counterclockwise direction
when viewed from the top of the package and the HV53 shifts in
the clockwise direction. A data output buffer is provided for
cascading devices. This output reflects the current status of the
last bit of the shift register (32). Operation of the shift register is
not affected by the LE (latch enable) or the OE (output enable)
inputs. Transfer of data from the shift register to the latch occurs
when the LE input is high. The data in the latch is retained when
LE is low.
Absolute Maximum Ratings
1
Supply voltage, V
DD2
Supply voltage, V
PP
Logic input levels
2
Ground current
3
Continuous total power dissipation
4
Operating temperature range
Storage temperature range
Lead temperature 1.6mm (1/16 inch)
from case for 10 seconds
Plastic
Ceramic
Plastic
Ceramic
-0.5V to +16V
-0.5V to +90V
-0.5 to V
DD
+ 0.5V
1.5A
1200mW
1500mW
-40°C to +85°C
-55°C to 125°C
-65°C to +150°C
260°C
Notes:
1. Device will survive (but operation may not be specified or guaranteed) at
these extremes.
2. All voltages are referenced to GND.
3. Duty cycle is limited by the total power dissipated in the package.
4. For operation above 25°C ambient derate linearly to maximum operating
temperature at 20mW/°C for plastic and at 15mW/°C for ceramic.
12/13/01
Supertex Inc. does not recommend the use of its products in life support applications and will not knowingly sell its products for use in such applications unless it receives an adequate "products liability
indemnification insurance agreement." Supertex does not assume responsibility for use of devices described and limits its liability to the replacement of devices determined to be defective due to
1
workmanship. No responsibility is assumed for possible omissions or inaccuracies. Circuitry and specifications are subject to change without notice. For the latest product specifications, refer to the
Supertex website: http://www.supertex.com. For complete liability information on all Supertex products, refer to the most current databook or to the Legal/Disclaimer page on the Supertex website.
HV5308/HV5408
Electrical Characteristics
(V
PP
= 60V, V
DD
= 12V, T
A
=25°C)
DC Characteristics
Symbol
I
PP
I
DDQ
I
DD
V
OH
(Data)
V
OL
(Data)
I
IH
I
IL
V
OC
V
OH
V
OL
V
OH
V
OL
Parameter
V
PP
Supply Current
I
DD
Supply Current (Quiescent)
I
DD
Supply Current (Operating)
Shift Register Output Voltage
Shift Register Output Voltage
Current Leakage, any input
Current Leakage, any input
HV Output Clamp Diode Voltage
HV Output when Sourcing
HV Output when Sinking
HV Output when Sourcing
HV Output when Sinking
52
8
52
8
10.5
1
1
-1
-1.5
Min
Max
0.5
100
15
Units
mA
µA
mA
V
V
µA
µA
V
V
V
V
V
Conditions
HVoutputs HIGH to LOW
All inputs = V
DD
or GND
V
DD
= V
DD
max,
f
CLK
= 8 MHz
I
O
= 100µA
I
O
= 100µA
V
IN
= V
DD
V
IN
= 0
I
OL
= -100mA
I
OH
= -20mA, -40 to 85°C
I
OL
= 20mA, -40 to 85°C
I
OH
= -15mA, -55 to 125°C
I
OL
= 15mA, -55 to 125°C
AC Characteristics
Symbol
f
CLK
t
WL
or t
WH
t
SU
t
H
t
DLH
(Data)
t
DHL
(Data)
t
DLE
t
WLE
t
SLE
t
ON
t
OFF
Parameter
Clock Frequency
Clock width, HIGH or LOW
Setup time before CLK rises
Hold time after CLK rises
Data Output Delay after L to H CLK
Data Output Delay after H to L CLK
LE Delay after L to H CLK
Width of LE Pulse
LE Setup Time before L to H CLK
Delay from LE to HV
OUT
, L to H
Delay from LE to HV
OUT
, H to L
50
50
50
500
500
62
25
10
110
110
Min
Max
8
Units
MHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
C
L
= 15pF
C
L
= 15pF
Conditions
Recommended Operating Conditions
(over -40 to 85°C for plastic and -55°C to 125°C for ceramic)
Symbol
V
DD
V
PP
V
IH
V
IL
f
CLK
Parameter
Logic Voltage Supply
High Voltage Supply
Input HIGH Voltage
Input LOW Voltage
Clock Frequency
Min
10.8
8.0
V
DD
-2
0
0
Max
13.2
80
V
DD
2
8
Units
V
V
V
V
MHz
Note:
Power-up sequence should be the following:
1. Connect ground.
2. Apply V
DD
.
3. Set all inputs (Data, CLK, LE, etc.) to a known state.
4. Apply V
PP
.
5. The V
PP
should not fall below V
DD
or float during operation.
Power-down sequence should be the reverse of the above.
2
Microcontroller MCU
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