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HSMP-386C-TR2

Description
Pin Diode, 50V V(BR), Silicon, SC-70, 3 PIN
CategoryDiscrete semiconductor    diode   
File Size272KB,9 Pages
ManufacturerBroadcom
Download Datasheet Parametric View All

HSMP-386C-TR2 Overview

Pin Diode, 50V V(BR), Silicon, SC-70, 3 PIN

HSMP-386C-TR2 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerBroadcom
package instructionR-PDSO-G3
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresLOW DISTORTION
applicationATTENUATOR; SWITCHING
Minimum breakdown voltage50 V
ConfigurationSERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode component materialsSILICON
Diode typePIN DIODE
JESD-30 codeR-PDSO-G3
JESD-609 codee0
Minority carrier nominal lifetime0.5 µs
Number of components2
Number of terminals3
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
surface mountYES
technologyPOSITIVE-INTRINSIC-NEGATIVE
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
HSMP-386x
Surface Mount PIN Diodes
Data Sheet
Description/Applications
The HSMP-386x series of general purpose PIN diodes are
designed for two classes of applications. The first is attenu-
ators where current consumption is the most important
design consideration. The second application for this
series of diodes is in switches where low capacitance is the
driving issue for the designer.
The HSMP-386x series Total Capacitance (C
T
) and Total Re-
sistance (R
T
) are typical specifications. For applications that
require guaranteed performance, the general purpose HSMP-
383x series is recommended.
A SPICE model is not available for PIN diodes as SPICE
does not provide for a key PIN diode characteristic, carrier
lifetime.
Features
Unique Configurations in Surface Mount Packages
– Add Flexibility
– Save Board Space
– Reduce Cost
Switching
– Low Distortion Switching
– Low Capacitance
Attenuating
– Low Current Attenuating for Less Power
Consumption
Matched Diodes for Consistent Performance
Better Thermal Conductivity for Higher Power
Dissipation
Low Failure in Time (FIT) Rate
[1]
Lead-free Option Available
Pin Connections and Package Marking, SOT-363
1
2
3
6
5
4
Note:
1. For more information see the Surface Mount PIN Reliability Data
Sheet.
LUx
Notes:
1. Package marking provides orientation, identification, and date code.
2. See “Electrical Specifications” for appropriate package marking.
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