1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. The maximum allowable power dissipation at any T
A
(ambient temperature) is calculated using: P
D
(max) = (T
J
(max) – T
A
)
÷ θ
JA
. Exceeding the
maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. See Table 1 and the
“Thermal Considerations”
section for details.
4. Output voltage temperature coefficient is the worst case voltage change divided by the total temperature range.
5. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range
from 100µA to 500mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
6. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differen-
tial.
7. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load
current plus the ground pin current.
8. V
EN
is the voltage externally applied to devices with the EN (enable) input pin. [SO-8 (M) and TO-263-5 (U) packages only.]
9. Thermal regulation is the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation ef-
fects. Specifications are for a 500mA load pulse at V
IN
= 16V for t = 10ms.
10. C
BYP
is an optional, external bypass capacitor connected to devices with a BYP (bypass) or ADJ (adjust) pin. [SO-8 (M) and TO-263-5 (U) packages
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Test/Measurement
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