HYB25D256161CE-4 datasheet, PDF

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HYB25D256161CE-4: Description16M x 16 Double Data Rate Graphics DRAM; Categorystorage storage; File Size1MB，72 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/; Environmental Compliance

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HYB25D256161CE-4 Overview

16M x 16 Double Data Rate Graphics DRAM

HYB25D256161CE-4 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Infineon
Parts packaging code	TSOP2
package instruction	TSSOP, TSSOP66,.46
Contacts	66
Reach Compliance Code	compli
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.6 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	250 MHz
I/O type	COMMON
interleaved burst length	2,4,8
JESD-30 code	R-PDSO-G66
JESD-609 code	e3
length	22.22 mm
memory density	268435456 bi
Memory IC Type	DDR DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	66
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP66,.46
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	2.6 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	2,4,8
Maximum standby current	0.006 A
Maximum slew rate	0.315 mA
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	2.6 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	10.16 mm

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D a t a s h e et , R e v . 1 . 0 , F e b . 2 00 4

HYB25D256161CE-5

HYB25D256161CE-4

1 6 M x 1 6 D o u b l e D a t a R a t e G r a p h ic s D R A M

D D R SG R A M

Green Product

M e m or y P r o du c t s

N e v e r

s t o p

t h i n k i n g .

HYB25D256161CE-[4/5]

256-Mbit Double Data Rate SGRAM

Table of Contents

1.1

1.2

3.1

3.2

3.2.1

3.2.2

3.2.3

3.2.4

3.3

3.3.1

3.3.2

3.4

3.5

3.5.1

3.5.2

3.5.3

3.5.4

3.5.5

3.6

4.1

4.2

4.3

4.4

4.4.1

Overview

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Pin Configuration

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Functional Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Mode Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Burst Length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Burst Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Read Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Extended Mode Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DLL Enable/Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output Drive Strength . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Bank/Row Activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Reads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Simplified State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrical Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Normal Strength Pull-down and Pull-up Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Weak Strength Pull-down and Pull-up Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Timing Diagrams

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Package Outlines

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Datasheet

Rev.1.0, 2004-02

HYB25D256161CE-4 Related Products

	HYB25D256161CE-4	HYB25D256161CE	HYB25D256161CE-5
Description	16M x 16 Double Data Rate Graphics DRAM	16M x 16 Double Data Rate Graphics DRAM	16M x 16 Double Data Rate Graphics DRAM
Is it Rohs certified?	conform to	-	conform to
Maker	Infineon	-	Infineon
Parts packaging code	TSOP2	-	TSOP2
package instruction	TSSOP, TSSOP66,.46	-	TSSOP, TSSOP66,.46
Contacts	66	-	66
Reach Compliance Code	compli	-	compli
ECCN code	EAR99	-	EAR99
access mode	FOUR BANK PAGE BURST	-	FOUR BANK PAGE BURST
Maximum access time	0.6 ns	-	0.65 ns
Other features	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	250 MHz	-	200 MHz
I/O type	COMMON	-	COMMON
interleaved burst length	2,4,8	-	2,4,8
JESD-30 code	R-PDSO-G66	-	R-PDSO-G66
JESD-609 code	e3	-	e3
length	22.22 mm	-	22.22 mm
memory density	268435456 bi	-	268435456 bi
Memory IC Type	DDR DRAM	-	DDR DRAM
memory width	16	-	16
Number of functions	1	-	1
Number of ports	1	-	1
Number of terminals	66	-	66
word count	16777216 words	-	16777216 words
character code	16000000	-	16000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C
organize	16MX16	-	16MX16
Output characteristics	3-STATE	-	3-STATE
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	TSSOP	-	TSSOP
Encapsulate equivalent code	TSSOP66,.46	-	TSSOP66,.46
Package shape	RECTANGULAR	-	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	-	260
power supply	2.6 V	-	2.6 V
Certification status	Not Qualified	-	Not Qualified
refresh cycle	8192	-	8192
Maximum seat height	1.2 mm	-	1.2 mm
self refresh	YES	-	YES
Continuous burst length	2,4,8	-	2,4,8
Maximum standby current	0.006 A	-	0.005 A
Maximum slew rate	0.315 mA	-	0.25 mA
Maximum supply voltage (Vsup)	2.7 V	-	2.7 V
Minimum supply voltage (Vsup)	2.5 V	-	2.5 V
Nominal supply voltage (Vsup)	2.6 V	-	2.6 V
surface mount	YES	-	YES
technology	CMOS	-	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL
Terminal surface	Matte Tin (Sn)	-	Matte Tin (Sn)
Terminal form	GULL WING	-	GULL WING
Terminal pitch	0.65 mm	-	0.65 mm
Terminal location	DUAL	-	DUAL
Maximum time at peak reflow temperature	40	-	40
width	10.16 mm	-	10.16 mm

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