HYB25D256161CE-5 datasheet, PDF

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HYB25D256161CE-5: Description16M x 16 Double Data Rate Graphics DRAM; Categorystorage storage; File Size1MB，72 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/; Environmental Compliance

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HYB25D256161CE-5 Overview

16M x 16 Double Data Rate Graphics DRAM

HYB25D256161CE-5 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Infineon
Parts packaging code	TSOP2
package instruction	TSSOP, TSSOP66,.46
Contacts	66
Reach Compliance Code	compli
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Maximum access time	0.65 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	200 MHz
I/O type	COMMON
interleaved burst length	2,4,8
JESD-30 code	R-PDSO-G66
JESD-609 code	e3
length	22.22 mm
memory density	268435456 bi
Memory IC Type	DDR DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	66
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP66,.46
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	2.6 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	2,4,8
Maximum standby current	0.005 A
Maximum slew rate	0.25 mA
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	2.6 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	10.16 mm

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D a t a s h e et , R e v . 1 . 0 , F e b . 2 00 4

HYB25D256161CE-5

HYB25D256161CE-4

1 6 M x 1 6 D o u b l e D a t a R a t e G r a p h ic s D R A M

D D R SG R A M

Green Product

M e m or y P r o du c t s

N e v e r

s t o p

t h i n k i n g .

HYB25D256161CE-[4/5]

256-Mbit Double Data Rate SGRAM

Table of Contents

1.1

1.2

3.1

3.2

3.2.1

3.2.2

3.2.3

3.2.4

3.3

3.3.1

3.3.2

3.4

3.5

3.5.1

3.5.2

3.5.3

3.5.4

3.5.5

3.6

4.1

4.2

4.3

4.4

4.4.1

Overview

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Pin Configuration

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Functional Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Mode Register Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Burst Length . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Burst Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Read Latency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Extended Mode Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DLL Enable/Disable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output Drive Strength . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Bank/Row Activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Reads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Writes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Precharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Simplified State Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Electrical Characteristics

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Normal Strength Pull-down and Pull-up Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Weak Strength Pull-down and Pull-up Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Timing Diagrams

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Package Outlines

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Datasheet

Rev.1.0, 2004-02

HYB25D256161CE-5 Related Products

	HYB25D256161CE-5	HYB25D256161CE-4	HYB25D256161CE
Description	16M x 16 Double Data Rate Graphics DRAM	16M x 16 Double Data Rate Graphics DRAM	16M x 16 Double Data Rate Graphics DRAM
Is it Rohs certified?	conform to	conform to	-
Maker	Infineon	Infineon	-
Parts packaging code	TSOP2	TSOP2	-
package instruction	TSSOP, TSSOP66,.46	TSSOP, TSSOP66,.46	-
Contacts	66	66	-
Reach Compliance Code	compli	compli	-
ECCN code	EAR99	EAR99	-
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	-
Maximum access time	0.65 ns	0.6 ns	-
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	-
Maximum clock frequency (fCLK)	200 MHz	250 MHz	-
I/O type	COMMON	COMMON	-
interleaved burst length	2,4,8	2,4,8	-
JESD-30 code	R-PDSO-G66	R-PDSO-G66	-
JESD-609 code	e3	e3	-
length	22.22 mm	22.22 mm	-
memory density	268435456 bi	268435456 bi	-
Memory IC Type	DDR DRAM	DDR DRAM	-
memory width	16	16	-
Number of functions	1	1	-
Number of ports	1	1	-
Number of terminals	66	66	-
word count	16777216 words	16777216 words	-
character code	16000000	16000000	-
Operating mode	SYNCHRONOUS	SYNCHRONOUS	-
Maximum operating temperature	70 °C	70 °C	-
organize	16MX16	16MX16	-
Output characteristics	3-STATE	3-STATE	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TSSOP	TSSOP	-
Encapsulate equivalent code	TSSOP66,.46	TSSOP66,.46	-
Package shape	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-
Peak Reflow Temperature (Celsius)	260	260	-
power supply	2.6 V	2.6 V	-
Certification status	Not Qualified	Not Qualified	-
refresh cycle	8192	8192	-
Maximum seat height	1.2 mm	1.2 mm	-
self refresh	YES	YES	-
Continuous burst length	2,4,8	2,4,8	-
Maximum standby current	0.005 A	0.006 A	-
Maximum slew rate	0.25 mA	0.315 mA	-
Maximum supply voltage (Vsup)	2.7 V	2.7 V	-
Minimum supply voltage (Vsup)	2.5 V	2.5 V	-
Nominal supply voltage (Vsup)	2.6 V	2.6 V	-
surface mount	YES	YES	-
technology	CMOS	CMOS	-
Temperature level	COMMERCIAL	COMMERCIAL	-
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	-
Terminal form	GULL WING	GULL WING	-
Terminal pitch	0.65 mm	0.65 mm	-
Terminal location	DUAL	DUAL	-
Maximum time at peak reflow temperature	40	40	-
width	10.16 mm	10.16 mm	-

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