BXY43P-FPH datasheet, PDF - EEWORLD Datasheet

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BXY43P-FPH: DescriptionPin Diode, Silicon, HERMETIC SEALED, FP-4; CategoryDiscrete semiconductor diode; File Size76KB，4 Pages; ManufacturerSIEMENS; Websitehttp://www.infineon.com/

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BXY43P-FPH Overview

Pin Diode, Silicon, HERMETIC SEALED, FP-4

BXY43P-FPH Parametric

Parameter Name	Attribute value
Maker	SIEMENS
package instruction	S-CDFP-F4
Contacts	4
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	HIGH RELIABILITY
application	ATTENUATOR; SWITCHING
Configuration	COMMON CATHODE, 2 ELEMENTS
Maximum diode capacitance	0.85 pF
Diode component materials	SILICON
Maximum diode forward resistance	70 Ω
Diode type	PIN DIODE
JESD-30 code	S-CDFP-F4
Minority carrier nominal lifetime	0.65 µs
Number of components	2
Number of terminals	4
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	SQUARE
Package form	FLATPACK
Maximum power dissipation	0.5 W
Certification status	Not Qualified
surface mount	YES
technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	FLAT
Terminal location	DUAL
Base Number Matches	1

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HiRel

Silicon PIN Diode

Features

HiRel

Discrete and Microwave Semiconductor

¥ Current controlled RF resistor for RF attenuators

and switches

¥ High reverse voltage

¥ Matched diode - pair

¥ Hermetically sealed microwave package

qualified

¥ ESA/SCC Detail Spec. No.: 5513/030

ESD:

BXY 43P

lectro

tatic

ischarge sensitive device, observe handling precautions!

Marking

Ordering Code

see below

Pin Configuration

Package

Type

BXY 43P-FP (ql)

(ql) Quality Level: P: Professional Quality, Ordering Code: Q62702X164

H: High Rel Quality,

S: Space Quality,

Ordering Code: on request

ES: ESA Space Quality, Ordering Code: Q62702X167

(see

Chapter Order Instructions

for ordering example)

Table 1

Parameter

Reverse voltage

Forward current

Power dissipation

Operating temperature range

Storage temperature range

Soldering temperature

Junction temperature

Thermal resistance junction-case

Maximum Ratings

Symbol

Limit Values

150

400

500

55 to + 150

65 to + 175

+ 235

175

100

Unit

K/W

tot

stg

sol

th(j-c)

Semiconductor Group

Draft A02 1998-04-01

BXY43P-FPH Related Products

	BXY43P-FPH	BXY43P-FPS	BXY43P-FPP	BXY43P-FPES
Description	Pin Diode, Silicon, HERMETIC SEALED, FP-4	Pin Diode, Silicon, HERMETIC SEALED, FP-4	Pin Diode, Silicon, HERMETIC SEALED, FP-4	Pin Diode, Silicon, HERMETIC SEALED, FP-4
Maker	SIEMENS	SIEMENS	SIEMENS	SIEMENS
package instruction	S-CDFP-F4	S-CDFP-F4	S-CDFP-F4	S-CDFP-F4
Contacts	4	4	4	4
Reach Compliance Code	unknown	unknown	unknown	unknown
Other features	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY
application	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING	ATTENUATOR; SWITCHING
Configuration	COMMON CATHODE, 2 ELEMENTS	COMMON CATHODE, 2 ELEMENTS	COMMON CATHODE, 2 ELEMENTS	COMMON CATHODE, 2 ELEMENTS
Maximum diode capacitance	0.85 pF	0.85 pF	0.85 pF	0.85 pF
Diode component materials	SILICON	SILICON	SILICON	SILICON
Maximum diode forward resistance	70 Ω	70 Ω	70 Ω	70 Ω
Diode type	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE
JESD-30 code	S-CDFP-F4	S-CDFP-F4	S-CDFP-F4	S-CDFP-F4
Minority carrier nominal lifetime	0.65 µs	0.65 µs	0.65 µs	0.65 µs
Number of components	2	2	2	2
Number of terminals	4	4	4	4
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	FLATPACK	FLATPACK	FLATPACK
Maximum power dissipation	0.5 W	0.5 W	0.5 W	0.5 W
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	YES
technology	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	FLAT	FLAT	FLAT	FLAT
Terminal location	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1

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