5962-9559505HMC datasheet, PDF

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5962-9559505HMC: DescriptionSRAM Module, 128KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68; Categorystorage storage; File Size190KB，13 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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5962-9559505HMC Overview

SRAM Module, 128KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68

5962-9559505HMC Parametric

Parameter Name	Attribute value
Parts packaging code	QFP
package instruction	QFP, QFP68,1.1SQ,50
Contacts	68
Reach Compliance Code	compliant
ECCN code	3A001.A.2.C
Maximum access time	55 ns
Other features	ALSO CONFIGURABLE AS 512K X 8
Spare memory width	16
I/O type	COMMON
JESD-30 code	S-CQFP-G68
JESD-609 code	e4
length	22.352 mm
memory density	4194304 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	68
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	128KX32
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QFP
Encapsulate equivalent code	QFP68,1.1SQ,50
Package shape	SQUARE
Package form	FLATPACK
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum standby current	0.0116 A
Minimum standby current	2 V
Maximum slew rate	0.6 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	QUAD
width	22.352 mm
Base Number Matches	1

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SRAM

AS8S128K32

128K x 32 SRAM

SRAM MEMORY ARRAY

AVAILABLE AS MILITARY SPECIFICATIONS

• SMD 5962-95595: -Q

• SMD 5962-93187: -P or -PN

• MIL-STD-883

PIN ASSIGNMENT

(Top View)

68 Lead CQFP (Q & Q1)

FEATURES

• Access times of 15, 17, 20, 25, 35, and 45 ns

• Built in decoupling caps for low noise operation

• Organized as 128K x32; User conﬁgured as

256Kx16 or 512K x8

• Operation with single 5 volt supply

• Low power CMOS

• TTL Compatible Inputs and Outputs

• 2V Data Retention, Low power standby

66 Lead PGA- Pins 8, 21, 28, 39 are grounds (P)

OPTIONS

•

Timing

15ns

17ns

20ns

25ns

35ns

45ns

Package

Ceramic Quad Flatpack

Pin Grid Array -8 Series

MARKINGS

-15

-17

-20

-25

-35

-45

•

No. 702

66 Lead PGA- Pins 8, 21, 28, 39 are no connects (PN)

No. 802

NOTE:

PN indicates a no connect on pins 8, 21, 28, 39

GENERAL DESCRIPTION

The AS8S128K32 is a 4 Megabit CMOS SRAM Module

organized as 128Kx32-bits and user conﬁgurable to 256Kx16

or 512Kx8. The AS8S128K32 achieves high speed access, low

power consumption and high reliability by employing advanced

CMOS memory technology.

The military temperature grade product is suited for military

applications.

The AS8S128K32 is offered in a ceramic quad ﬂatpack

module per SMD-5962-95595 with a maximum height of 0.140

inches. This module makes use of a low proﬁle, mutlichip mod-

ule design.

This device is also offered in a 1.075 inch square ceramic pin

grid array per SMD 5692-93187, which has a maximum height

of 0.195 inches. This package is also a low proﬁle, multi-chip

module design reducing height requirements to a minimum.

CE4

WE4

128K x 8

CE3

WE3

128K x 8

I/O 24 - I/O 31

128K x 8

CE2

WE2

I/O 16 - I/O 23

CE1

WE1

A0 - 16

128K x 8

For more products and information

please visit our web site at

www.micross.com

AS8S128K32

Rev. 4.3 01/10

I/O 8 - I/O 23

I/O 0 - I/O 7

Micross Components reserves the right to change products or speciﬁcations without notice.

5962-9559505HMC Related Products

	5962-9559505HMC	5962-9318705H5A	5962-9318705H5C	5962-9559505HMA	5962-9318705H4A	5962-9318705H4C
Description	SRAM Module, 128KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68	SRAM Module, 128KX32, 55ns, CMOS, CPGA66, PGA-66	SRAM Module, 128KX32, 55ns, CMOS, PGA-66	SRAM Module, 128KX32, 55ns, CMOS, CQFP68, CERAMIC, QFP-68	SRAM Module, 128KX32, 55ns, CMOS, CPGA66, PGA-66	SRAM Module, 128KX32, 55ns, CMOS, PGA-66
Parts packaging code	QFP	PGA	PGA	QFP	PGA	PGA
package instruction	QFP, QFP68,1.1SQ,50	PGA, PGA66,11X11	PGA, PGA66,11X11	QFP, QFP68,1.1SQ,50	PGA, PGA66,11X11	PGA, PGA66,11X11
Contacts	68	66	66	68	66	66
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	55 ns	55 ns	55 ns	55 ns	55 ns	55 ns
Other features	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8	ALSO CONFIGURABLE AS 512K X 8
Spare memory width	16	16	16	16	16	16
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-CQFP-G68	S-XPGA-P66	S-XPGA-P66	S-CQFP-G68	S-XPGA-P66	S-XPGA-P66
JESD-609 code	e4	e0	e4	e0	e0	e4
length	22.352 mm	27.305 mm	27.305 mm	22.352 mm	27.305 mm	27.305 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1
Number of terminals	68	66	66	68	66	66
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	128KX32	128KX32	128KX32	128KX32	128KX32	128KX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
encapsulated code	QFP	PGA	PGA	QFP	PGA	PGA
Encapsulate equivalent code	QFP68,1.1SQ,50	PGA66,11X11	PGA66,11X11	QFP68,1.1SQ,50	PGA66,11X11	PGA66,11X11
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	GRID ARRAY	GRID ARRAY	FLATPACK	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Qualified	Qualified	Qualified	Qualified	Qualified	Qualified
Filter level	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883	MIL-STD-883
Maximum seat height	5.08 mm	4.953 mm	4.953 mm	5.08 mm	4.953 mm	4.953 mm
Maximum standby current	0.0116 A	0.0116 A	0.0116 A	0.0116 A	0.0116 A	0.0116 A
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	0.6 mA	0.6 mA	0.6 mA	0.6 mA	0.6 mA	0.6 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	GOLD	TIN LEAD	GOLD	TIN LEAD	TIN LEAD	GOLD
Terminal form	GULL WING	PIN/PEG	PIN/PEG	GULL WING	PIN/PEG	PIN/PEG
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	PERPENDICULAR	PERPENDICULAR	QUAD	PERPENDICULAR	PERPENDICULAR
width	22.352 mm	27.305 mm	27.305 mm	22.352 mm	27.305 mm	27.305 mm
Base Number Matches	1	1	1	1	1	1

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