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3SMBJ5930B-TPX01

Description
Zener Diode,
CategoryDiscrete semiconductor    diode   
File Size363KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

3SMBJ5930B-TPX01 Overview

Zener Diode,

3SMBJ5930B-TPX01 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Reach Compliance Codeunknown
Base Number Matches1
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
3SMBJ5913B-TPX01
THRU
3SMBJ5943B-TPX01
3.0 Watt
Surface Mount
Silicon
Zener Diodes
DO-214AA
(SMB) (LEAD FRAME)
Features
Lead Free Finish/RoHS Compliant (Note1) ("P" Suffix designates
RoHS Compliant. See ordering information)
3.3thru
56
Volt Voltage Range
Low Inductance,Low Profile Mounting
Glass Passivated Junction
Available on Tape and Reel
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisure Sensitivity Level 1
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
A
Maximum temperature for soldering: 260 C for 10 seconds.
0
Maximum Ratings @ 25
o
C Unless Otherwise Specified
C
B
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
V
F
P
d
T
J
, T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
(Note:
2)
(Note:
3)
E
D
F
H
G
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
DIM
A
B
C
D
E
F
G
H
Note:
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
2.
3.
Forward Current @ 200mA.
Mounted on 5.0mm (1oz thick) Iand areas.
Lead temperature at T
L
=75 C
o
2
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.083”
0.050”
Revision:
A
www.mccsemi.com
1 of 4
2011/01/01
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