The UT54ACS109 and the UT54ACTS109 are dual J-K positive
triggered flip-flops. A low level at the preset or clear inputs sets
or resets the outputs regardless of the other input levels. When
preset and clear are inactive (high), data at the J and K input
meeting the setup time requirements are transferred to the out-
puts on the positive-going edge of the clock pulse. Following
the hold time interval, data at the J and K input can be changed
without affecting the levels at the outputs. The flip-flops can
perform as toggle flip-flops by grounding K and tying J high.
They also can perform as D flip-flops if J and K are tied together.
The devices are characterized over full military temperature
range of -55°C to +125°C.
FUNCTION TABLE
INPUTS
PRE
L
H
L
H
H
H
H
H
CLR
H
L
L
H
H
H
H
H
CLK
X
X
X
↑
↑
↑
↑
L
J
X
X
X
L
H
L
H
X
K
X
X
X
L
L
H
H
X
OUTPUT
Q
H
L
H
L
1
PINOUTS
16-Pin DIP
Top View
CLR1
J
K1
CLK1
PRE1
Q1
Q1
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
CLR2
J2
K2
CLK2
PRE2
Q2
Q2
16-Lead Flatpack
Top View
CLR1
J1
K1
CLK1
PRE1
Q1
Q1
V
SS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
DD
CLR2
J2
K2
CLK2
PRE2
Q2
Q2
LOGIC SYMBOL
Q
L
H
H
1
PRE1
J1
CLK1
K1
CLR1
PRE2
J2
CLK2
(5)
(2)
(4)
(3)
(1)
(11)
(14)
(12)
S
J1
C1
K1
R
(6)
Q1
(7)
Q1
H
Toggle
(10)
Q2
No Change
H
L
(13)
K2
(15)
CLR2
(9)
Q2
No Change
Note:
1. Logic symbol in accordance with ANSI/IEEE standard 91-1984 and
IEC Publication 617-12.
Note:
1. The output levels in this configuration are not guaranteed to meet the minimum
levels for V
OH
if the lows at preset and clear are near V
IL
maximum. In
addition, this configuration is nonstable; that is, it will not persist when either
preset or clear returns to its inactive (high) level.
1
LOGIC DIAGRAM
PRE
CLK
Q
J
Q
K
CLR
2
OPERATIONAL ENVIRONMENT
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6 (ACTS109)
5.0E5 (ACS109)
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at
these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
4.5 to 5.5
0 to V
DD
-55 to + 125
UNITS
V
V
°C
3
DC ELECTRICAL CHARACTERISTICS
7
(V
DD
= 5.0V
±
10%; V
SS
= 0V
6
, -55°C < T
C
< +125°C); Unless otherwise noted, Tc is per the temperature range ordered.
SYMBOL
V
IL
PARAMETER
Low-level input voltage
1
ACTS
ACS
High-level input voltage
1
ACTS
ACS
Input leakage current
ACTS/ACS
Low-level output voltage
3
ACTS
ACS
High-level output voltage
3
ACTS
ACS
Short-circuit output current
2 ,4
ACTS/ACS
Output current
10
(Sink)
I
OH
Output current
10
(Source)
P
total
I
DDQ
ΔI
DDQ
Power dissipation
2, 8,9
Quiescent Supply Current
Quiescent Supply Current Delta
ACTS
V
IN
= V
DD
or V
SS
I
OL
= 8.0mA
I
OL
= 100μA
I
OH
= -8.0mA
I
OH
= -100μA
V
O
= V
DD
and V
SS
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
V
IN
= V
DD
or V
SS
V
OH
= V
DD
- 0.4V
C
L
= 50pF
V
DD
= 5.5V
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
V
DD
= 5.5V
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
ƒ
= 1MHz @ 0V
ƒ
= 1MHz @ 0V
15
15
pF
pF
2.0
10
1.6
mW/
MHz
μA
mA
-8
mA
.7V
DD
V
DD
- 0.25
-200
8
200
.5V
DD
.7V
DD
-1
1
CONDITION
MIN
MAX
0.8
.3V
DD
UNIT
V
V
IH
V
I
IN
V
OL
μA
0.40
0.25
V
V
OH
V
I
OS
I
OL
mA
mA
4
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, -
50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are
guaranteed to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤
5.0E5 amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765
pF/MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All ACTS specifications are valid for radiation dose <1E6 rads(Si), and all ACS specifications are valid for radiation dose <5E5 rads(Si).
8. Power does not include power contribution of any TTL output sink current.
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
[font=宋体]In the program I wrote before, when the measurement result is less than 100cm, the buzzer will sound an alarm. How can I change it now so that when the measurement distance is between 60-100c...
About the number of FLASH erase and write times of C3 version 9B96, etc.According to the latest official errata, the maximum number of erase and write times for the C3 and C5 versions of the chipFLASH...
I have registered MY.TI for a long time due to work needs. But I haven't placed an order yet. I happened to see a few good samples in the forum activities this time, so I applied. Follow the prompts t...
I just started to learn embedded Linux. I have a smartarm2400 development board made by Zhou Ligong, and the processor is arm7tdmi. I searched a lot of information on the Internet. Some said that it d...
With the booming electronics industry, vision systems have become a leader in the electronics automation sector. However, the delicate nature of electronic products often affects product yields due...[Details]
EtherCAT (Ethernet for Control Automation Technology) is a real-time industrial fieldbus communication protocol based on an Ethernet-based development framework. EtherCAT is one of the fastest indu...[Details]
On August 24th, media outlets reported, citing sources, that NavInfo, a listed company on the A-share market, is nearing completion in its acquisition of the intelligent driving c...[Details]
Electric motors and internal combustion engines of the same power have similar torque levels. High power requires high torque, and torque determines a vehicle's acceleration speed, commonly known a...[Details]
Zos Automotive Research Institute released the "2025
Smart Cockpit
Tier 1 Research Report (Domestic Edition)."
This report analyzes the operating conditions of more than a dozen ...[Details]
When discussing autonomous driving technology, there are often two extremes: on the one hand, there's the vision of "fully autonomous driving," while on the other, there's concern about potential s...[Details]
With the advancement of science and technology and the promotion of green, energy-saving, and circular development, the demand for precise control and accurate measurement is increasing. In the pow...[Details]
Plug-in hybrid vehicles (PHEVs) utilize two powertrains. Their pure electric range is typically inferior to that of pure electric vehicles, often reaching less than half that. Currently, mainstream...[Details]
With the prevalence of online conferencing, live streaming, and voice communication in gaming, high-quality audio input devices are becoming increasingly important. To this end, XMOS, an expert in ...[Details]
0 Introduction
Portable terminals integrate a computer and display screen into a single device. Due to limited space in portable devices, previous designs often used a single-chip microcompute...[Details]
Since the beginning of the 21st century, with the rapid development of my country's urban and rural economies and the improvement of people's living standards, more and more people have begun to ow...[Details]
This new standardized, pre-integrated computing platform is designed to accelerate chip development, reduce development costs, and provide scalable software to power the AI-defined car.
...[Details]
introduction
In the context of the comprehensive development of the Internet of Things (IoT) technology under the "Perceiving China" initiative, "Perceiving Mines" is a crucial component of Ch...[Details]
On August 9th, at the 2025 World Robotics Conference (WRC), Shenzhen Cyborg Robotics Co., Ltd. officially unveiled the Cyborg-H01, the world's first lightweight bionic dexterous hand. This core com...[Details]
With the continuous advancement of technology, automation has become a ubiquitous technology, widely used in various industries. However, for many electricians, automation still seems like a diffic...[Details]
51mcu
京公网安备 11010802033920号
EEWORLD
