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ISD2575SI

Description
Speech Synthesizer With RCDG, 79.7s, CMOS, PDSO28, 0.300 INCH, SOIC-28
CategoryAnalog mixed-signal IC    Consumption circuit   
File Size348KB,28 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Download Datasheet Parametric Compare View All

ISD2575SI Overview

Speech Synthesizer With RCDG, 79.7s, CMOS, PDSO28, 0.300 INCH, SOIC-28

ISD2575SI Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerWinbond Electronics Corporation
Parts packaging codeSOIC
package instruction0.300 INCH, SOIC-28
Contacts28
Reach Compliance Codenot_compliant
applicationPUSH BUTTON AND MESSAGE CUEING
Commercial integrated circuit typesSPEECH SYNTHESIZER WITH RCDG
JESD-30 codeR-PDSO-G28
JESD-609 codee0
length17.9 mm
Number of functions1
Number of terminals28
On-chip memory typeEEPROM
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP28,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum read time79.7 s
Maximum seat height2.65 mm
Maximum slew rate30 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.5 mm
Base Number Matches1
®
ISD2500 Series
Single-Chip Voice Record/Playback Devices
32-*, 40-*, 48-*, 64-*
, 60-, 75-,
90-, and 120-Second Durations
FEATURES
Easy-to-use single-chip voice Record/
Playback solution
High-quality, natural voice/audio
reproduction
Manual switch or microcontroller compati-
ble Playback can be edge- or level-
activated
Single-chip durations of
32*, 40*, 48*, 64*
,
60, 75, 90, and 120 seconds
Directly cascadable for longer durations
Automatic Power-Down (Push-Button
Mode)
– Standby current 1
µA
(typical)
Zero-power message storage
– Eliminates battery backup circuits
Fully addressable to handle multiple
messages
100-year message retention (typical)
100,000 record cycles (typical)
On-chip clock source
No algorithm development required
Single +5 volt power supply
Available in die form, DIP, SOIC, and
TSOP packaging
Industrial temperature (-40°C to +85°C)
versions available
1
ISD2500 SERIES SUMMARY
Part
Number
ISD2560
ISD2575
ISD2590
ISD25120
Duration
(Seconds)
60
75
90
120
Input Sample
Rate (KHz)
8.0
6.4
5.3
4.0
Typical Filter
Pass Band (KHz)
3.4
2.7
2.3
1.7
ISD2532*
ISD2540*
ISD2548*
ISD2564*
32
40
48
64
8.0
6.4
5.3
4.0
3.4
2.7
2.3
1.7
Information Storage Devices, Inc.
*
Advance information: ISD2532/40/48/64 devices.
1–79

ISD2575SI Related Products

ISD2575SI ISD2560SI ISD2575EI ISD2560EI
Description Speech Synthesizer With RCDG, 79.7s, CMOS, PDSO28, 0.300 INCH, SOIC-28 Speech Synthesizer With RCDG, 63.8s, CMOS, PDSO28, 0.300 INCH, SOIC-28 Speech Synthesizer With RCDG, 79.7s, CMOS, PDSO28, 8 X 13.40 MM, TSOP-28 Speech Synthesizer With RCDG, 63.8s, CMOS, PDSO28, 8 X 13.40 MM, TSOP-28
Maker Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation Winbond Electronics Corporation
Parts packaging code SOIC SOIC TSOP TSOP
package instruction 0.300 INCH, SOIC-28 0.300 INCH, SOIC-28 TSOP1, TSOP1,
Contacts 28 28 28 28
Reach Compliance Code not_compliant not_compliant unknown unknown
application PUSH BUTTON AND MESSAGE CUEING PUSH BUTTON AND MESSAGE CUEING PUSH BUTTON AND MESSAGE CUEING PUSH BUTTON AND MESSAGE CUEING
Commercial integrated circuit types SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG SPEECH SYNTHESIZER WITH RCDG
JESD-30 code R-PDSO-G28 R-PDSO-G28 R-PDSO-G28 R-PDSO-G28
JESD-609 code e0 e0 e4 e4
length 17.9 mm 17.9 mm 11.8 mm 11.8 mm
Number of functions 1 1 1 1
Number of terminals 28 28 28 28
On-chip memory type EEPROM EEPROM EEPROM EEPROM
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP TSOP1 TSOP1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum read time 79.7 s 63.8 s 79.7 s 63.8 s
Maximum seat height 2.65 mm 2.65 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 0.55 mm 0.55 mm
Terminal location DUAL DUAL DUAL DUAL
width 7.5 mm 7.5 mm 8 mm 8 mm
Base Number Matches 1 1 1 1
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