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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX51CEC
Rev. 6,
10/2012
IMX51
i.MX51 Applications
Processors for Consumer and
Industrial Products
Package Information
Plastic Package
Case 2058 13 x 13 mm, 0.5 mm pitch
Case 2017 19 x 19 mm, 0.8 mm pitch
Ordering Information
See
Table 1
on
page 3
for ordering information.
1
Introduction
The i.MX51 multimedia applications processors
represent Freescale Semiconductor’s latest addition to a
growing family of multimedia-focused products that
offer high performance processing and are optimized for
lowest power consumption.
The i.MX51 processors feature Freescale’s advanced and
power-efficient implementation of the ARM
Cortex™-A8 core, which operates at speeds as high as
800 MHz. Up to 200 MHz DDR2 and mobile DDR
DRAM clock rates are supported. These devices are
suitable for applications such as the following:
• Netbooks (web tablets)
• Nettops (Internet desktop devices)
• Mobile Internet devices (MID)
• Portable media players (PMP)
• Portable navigation devices (PND)
• High-end PDAs
• Gaming consoles
• Automotive navigation and entertainment (see
automotive data sheet, IMX51AEC)
© 2012 Freescale Semiconductor, Inc. All rights reserved.
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1. Special Signal Considerations . . . . . . . . . . . . . . . 12
3. IOMUX Configuration for Boot Media . . . . . . . . . . . . . . . 14
3.1. NAND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.2. SD/MMC IOMUX Pin Configuration . . . . . . . . . . . 15
3.3. I
2
C IOMUX Pin Configuration . . . . . . . . . . . . . . . . 15
3.4. eCSPI/CSPI IOMUX Pin Configuration . . . . . . . . 16
3.5. Wireless External Interface Module (WEIM) . . . . 16
3.6. UART IOMUX Pin Configuration . . . . . . . . . . . . . 16
3.7. USB-OTG IOMUX Pin Configuration . . . . . . . . . . 16
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17
4.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 24
4.4. Output Buffer Impedance Characteristics . . . . . . 31
4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 35
4.6. Module Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.7. External Peripheral Interfaces . . . . . . . . . . . . . . . 74
5. Package Information and Contact Assignments . . . . . 153
5.1. 13 x 13 mm Package Information . . . . . . . . . . . . 153
5.2. 19 x 19 mm Package Information . . . . . . . . . . . . 173
5.3. 13
×
13 mm, 0.5 Pitch Ball Map . . . . . . . . . . . . . 191
5.4. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 195
6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 199
Introduction
Features include the following:
•
Smart Speed Technology—The
heart of the i.MX51 processors is a level of power management
throughout the device that enables the rich suite of multimedia features and peripherals to achieve
minimum system power consumption in both active and various low-power modes. Smart Speed
Technology enables the designer to deliver a feature-rich product that requires levels of power that
are far less than typical industry expectations.
•
Applications Processor—The
i.MX51 processors boost the capabilities of high-tier portable
applications by providing for the ever-increasing MIPS needs of operating systems and games.
Freescale’s Dynamic Voltage and Frequency Scaling (DVFS) allows the device run at much lower
voltage and frequency with sufficient MIPS for tasks such as audio decode resulting in significant
power reduction.
•
Multimedia Powerhouse—The
multimedia performance of the i.MX51 processors is boosted by
a multi-level cache system and further enhanced by a Multi-Standard Hardware Video Codec,
autonomous Image Processing Unit, SD and HD720p Triple Video (TV) Encoder with triple video
DAC, Neon (including Advanced SIMD, 32-bit Single-Precision floating point support and Vector
Floating Point co-processor), and a programmable smart DMA (SDMA) controller.
•
Powerful Graphics Acceleration—Graphics
is the key to mobile game navigation, web browsing,
and other applications. The i.MX51 processors provide two independent, integrated Graphics
Processing Units: OpenGL ES 2.0 3D graphics accelerator (27 Mtri/s, 166 Mpix/s) and
OpenVG 1.1 2D graphics accelerator (166 Mpix/s).
•
Interface Flexibility—The
i.MX51 processor interface supports connection to all popular types of
external memories: DDR2, Mobile DDR, NOR Flash, PSRAM, Cellular RAM, NAND Flash
(MLC and SLC), and OneNAND. Designers seeking to provide products that deliver a rich
multimedia experience find a full suite of on-chip peripherals: LCD controller and CMOS sensor
interface, High-Speed USB On-The-Go with PHY, and three High-Speed USB hosts, multiple
expansion card ports (High-Speed MMC/SDIO Host and others), 10/100 Ethernet controller, and
a variety of other popular interfaces (PATA, UART, I
2
C, I
2
S serial audio, and SIM card, among
others).
•
Increased Security—Because
the need for advanced security for mobile devices continues to
increase, the i.MX51 processors deliver hardware-enabled security features that enable secure
e-commerce, digital rights management (DRM), information encryption, secure boot, and secure
software downloads. For detailed information about the MX51 security features contact your
Freescale representative.
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 6
2
Freescale Semiconductor
Introduction
1.1
Ordering Information
Table 1. Ordering Information
1
2,
Table 1
provides the ordering information.
Part Number
Mask Set
Features
Case
Temperature
Range (
°
C)
–40 to 95
–20 to 85
–40 to 95
–20 to 85
–40 to 95
–20 to 85
–20 to 85
Package
3
MCIMX512CJM6C
MCIMX512DJM8C
MCIMX513CJM6C
MCIMX513DJM8C
MCIMX515CJM6C
MCIMX515DJM8C
MCIMX515DVK8C!
1
M77X
M77X
M77X
M77X
M77X
M77X
M77X
No hardware video codecs
No hardware graphics accelerators
No hardware video codecs
No hardware graphics accelerators
No hardware graphics accelerators
No hardware graphics accelerators
Full specification
Full specification
Full specification
19 x 19 mm, 0.8 mm pitch BGA
Case 2017
19 x 19 mm, 0.8 mm pitch BGA
Case 2017
19 x 19 mm, 0.8 mm pitch BGA
Case 2017
19 x 19 mm, 0.8 mm pitch BGA
Case 2017
19 x 19 mm, 0.8 mm pitch BGA
Case 2017
19 x 19 mm, 0.8 mm pitch BGA
Case 2017
13 x 13 mm, 0.5 mm pitch BGA
Case 2058
For Junction Temperature (Tj) maximum ratings, see
Table 11, "Absolute Maximum Ratings," on page 18.
Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010:
Indicated by the Icon (!)
3
Case 2017 and Case 2058 are RoHS compliant, lead-free, MSL = 3.
2
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 6
Freescale Semiconductor
3
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