MCIMX515DJM8C datasheet, PDF - EEWORLD Datasheet

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MCIMX515DJM8C: DescriptionSPECIALTY MICROPROCESSOR CIRCUIT, PBGA529, 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529; CategoryThe embedded processor and controller Microcontrollers and processors; File Size5MB，204 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/; Environmental Compliance

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MCIMX515DJM8C Overview

SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529, 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529

MCIMX515DJM8C Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Rochester Electronics
Parts packaging code	BGA
package instruction	19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529
Contacts	529
Reach Compliance Code	unknown
JESD-30 code	S-PBGA-B529
JESD-609 code	e1
length	19 mm
Humidity sensitivity level	3
Number of terminals	529
Maximum operating temperature	85 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
Maximum seat height	1.6 mm
Maximum supply voltage	1.15 V
Minimum supply voltage	1.05 V
Nominal supply voltage	1.1 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	19 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT
Base Number Matches	1

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Introduction

Features include the following:

•

Smart Speed Technology—The

heart of the i.MX51 processors is a level of power management

throughout the device that enables the rich suite of multimedia features and peripherals to achieve

minimum system power consumption in both active and various low-power modes. Smart Speed

Technology enables the designer to deliver a feature-rich product that requires levels of power that

are far less than typical industry expectations.

•

Applications Processor—The

i.MX51 processors boost the capabilities of high-tier portable

applications by providing for the ever-increasing MIPS needs of operating systems and games.

Freescale’s Dynamic Voltage and Frequency Scaling (DVFS) allows the device run at much lower

voltage and frequency with sufficient MIPS for tasks such as audio decode resulting in significant

power reduction.

•

Multimedia Powerhouse—The

multimedia performance of the i.MX51 processors is boosted by

a multi-level cache system and further enhanced by a Multi-Standard Hardware Video Codec,

autonomous Image Processing Unit, SD and HD720p Triple Video (TV) Encoder with triple video

DAC, Neon (including Advanced SIMD, 32-bit Single-Precision floating point support and Vector

Floating Point co-processor), and a programmable smart DMA (SDMA) controller.

•

Powerful Graphics Acceleration—Graphics

is the key to mobile game navigation, web browsing,

and other applications. The i.MX51 processors provide two independent, integrated Graphics

Processing Units: OpenGL ES 2.0 3D graphics accelerator (27 Mtri/s, 166 Mpix/s) and

OpenVG 1.1 2D graphics accelerator (166 Mpix/s).

•

Interface Flexibility—The

i.MX51 processor interface supports connection to all popular types of

external memories: DDR2, Mobile DDR, NOR Flash, PSRAM, Cellular RAM, NAND Flash

(MLC and SLC), and OneNAND. Designers seeking to provide products that deliver a rich

multimedia experience find a full suite of on-chip peripherals: LCD controller and CMOS sensor

interface, High-Speed USB On-The-Go with PHY, and three High-Speed USB hosts, multiple

expansion card ports (High-Speed MMC/SDIO Host and others), 10/100 Ethernet controller, and

a variety of other popular interfaces (PATA, UART, I

C, I

S serial audio, and SIM card, among

others).

•

Increased Security—Because

the need for advanced security for mobile devices continues to

increase, the i.MX51 processors deliver hardware-enabled security features that enable secure

e-commerce, digital rights management (DRM), information encryption, secure boot, and secure

software downloads. For detailed information about the MX51 security features contact your

Freescale representative.

i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 6

Freescale Semiconductor

MCIMX515DJM8C Related Products

	MCIMX515DJM8C	MCIMX513CJM6C	MCIMX515CJM6C	MCIMX515DVK8C
Description	SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529, 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529	SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529, 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529	SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529, 19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529	SPECIALTY MICROPROCESSOR CIRCUIT, PBGA625, 13 X 13 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-625
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
Parts packaging code	BGA	BGA	BGA	BGA
package instruction	19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529	19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529	19 X 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-529	13 X 13 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-625
Contacts	529	529	529	625
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	S-PBGA-B529	S-PBGA-B529	S-PBGA-B529	S-PBGA-B625
JESD-609 code	e1	e1	e1	e1
length	19 mm	19 mm	19 mm	13 mm
Humidity sensitivity level	3	3	3	3
Number of terminals	529	529	529	625
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C	-20 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	LFBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.3 mm
Maximum supply voltage	1.15 V	1.1 V	1.1 V	1.15 V
Minimum supply voltage	1.05 V	0.95 V	0.95 V	1.05 V
Nominal supply voltage	1.1 V	1 V	1 V	1.1 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER
Terminal surface	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40	40	40
width	19 mm	19 mm	19 mm	13 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT
Base Number Matches	1	1	1	1

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