Product Guide
1211C Series Bi-Color Ultra Compact SMT LED
s
Features
• Superbright, compact bicolor package
• 1.6mm (L) x 1.5mm (W) x 0.7mm (H)
s
Applications
• Mobile devices (cellular telephone, PDAs, pagers)
• Telecommunications
s
Outline Dimensions
Unit: mm
Tolerances + 0.1
s
Electro-Optical Characteristics
Part No. Material
Emitted Lens
Color Color
Red (BR)
Yellow-Green (PY)
Red (BR)
Green (PG)
Red (BR)
Pure Green (BG)
Milky
White
(Ta=25°C)
Wavelength
Peak
λ
p
TYP.
Spectral Line
Dominant Half Width
λ
d
λ
∆λ
TYP.
TYP.
I
F
Luminous
Intensity
IV
MIN.
TYP.
I
F
Forward
Voltage
V
TYP.
MAX.
F
Reverse Viewing
Current
IR
Angle
I
F
MAX.
V
R
(2
θ
1/2)
GaAIAs
BRPY1211C
GaP
GaAIAs
BRPG1211C
GaP
GaAlAs
BRBG1211C
GaP
7.0 11.7 20
7.0 11.7 20
7.0 11.7 20
4.5
1.7
6.4
2.4
20
20
mA
7.0 11.7 20
660
570
660
560
660
555
647
572
647
567
647
558
nm
30
30
30
30
30
30
20
20
20
20
20
20
mA
1.7
2.1
1.7
2.1
1.7
2.1
V
2.3
2.8
2.3
2.8
2.3
2.8
20
20
20
20
20
20
mA
100
100
100
100
100
100
µA
4
4
4
4
4
4
V
170°
150°
170°
150°
170°
150°
Deg.
Units
mcd
s
Absolute Maximum Ratings
Red (BR)
Yellow-Green (PY)
Red (BR)
Green (PG)
Red (BR)
Pure Green (BG)
(Ta=25°C)
Item
Symbol
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Pd
I
F
I
FM
V
R
Topr
Tstg
∆I
F
BRPY
70
25
60
4
BRPG
70
25
60
4
-30 to +85
-40 to +100
0.36 (DC) 0.86 (Pulse)
Units
BRBG
70
25
60
4
mW
mA
mA
V
°C
°C
mA/°C
* Ta=25°C,
I
FM
applies for the pulse width
≤
1msec. and duty cycle
≤1/20.
s
Taping Specifications
4+0.1
1.75+ 0.1
s
Operation Current Derating Chart (DC)
(0.2)
φ
1.5
+0.1
0
(1.7)
(φ 0.6)
Center
Hole
4+0.1
2+0.05
3.5 + 0.05
Quantity on tape:
4,000 pieces
per reel
(0.9)
2+0.5
φ
21+0.8
8+0.2
Direction to pull
+1
φ
60 -0
φ
13+0.2
BRPY, BRPG, BRBG
(1.8)
1.8
φ
13+0.2
9+0.3
11.4+1
+0
φ
180 3
s
Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
LED Surface Temperature
°C
Operation Heating
240
Temperature
rise: 5°C/sec.
Cooling:
—5°C/sec.
s
Spatial Distribution
150
120
Pre-heating
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PG1211C-0301
~
0
60 to 120 sec.
5 sec. max
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555
Website: www.stanley-electric.com
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