IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20, Bus Driver/Transceiver
| Parameter Name | Attribute value |
| Maker | NXP |
| Parts packaging code | DFP |
| package instruction | DFP, |
| Contacts | 20 |
| Reach Compliance Code | unknown |
| Base Number Matches | 1 |
| 54F374/BSA | 54F373/B2A | 54F373/BRA | 54F374/B2A | 54F373/BSA | 54F374/BRA | |
|---|---|---|---|---|---|---|
| Description | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20, Bus Driver/Transceiver | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LLCC-20, Bus Driver/Transceiver | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20, Bus Driver/Transceiver | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LLCC-20, Bus Driver/Transceiver | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, FP-20, Bus Driver/Transceiver | IC F/FAST SERIES, 8-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20, Bus Driver/Transceiver |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP |
| Parts packaging code | DFP | QLCC | DIP | QLCC | DFP | DIP |
| package instruction | DFP, | QCCN, | DIP, | CERAMIC, LLCC-20 | CERAMIC, FP-20 | DIP, |
| Contacts | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknown |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| series | - | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 code | - | S-CQCC-N20 | R-GDIP-T20 | S-CQCC-N20 | R-CDFP-F20 | R-GDIP-T20 |
| Load capacitance (CL) | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| Number of digits | - | 8 | 8 | 8 | 8 | 8 |
| Number of functions | - | 1 | 1 | 1 | 1 | 1 |
| Number of ports | - | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | - | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | - | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | - | QCCN | DIP | QCCN | DFP | DIP |
| Package shape | - | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | - | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK | IN-LINE |
| Maximum supply current (ICC) | - | 55 mA | 55 mA | 86 mA | 55 mA | 86 mA |
| propagation delay (tpd) | - | 8.5 ns | 8.5 ns | 11.5 ns | 8.5 ns | 11.5 ns |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | - | 1.905 mm | 5.08 mm | 1.905 mm | 2.54 mm | 5.08 mm |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | - | YES | NO | YES | YES | NO |
| technology | - | TTL | TTL | TTL | TTL | TTL |
| Temperature level | - | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | - | NO LEAD | THROUGH-HOLE | NO LEAD | FLAT | THROUGH-HOLE |
| Terminal pitch | - | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | - | QUAD | DUAL | QUAD | DUAL | DUAL |
| width | - | 8.89 mm | 7.62 mm | 8.89 mm | 6.9215 mm | 7.62 mm |