5962R9572701VEC datasheet, PDF

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5962R9572701VEC: DescriptionDecoder/Driver, HC/UH Series, Inverted Output, CMOS, CDIP16; Categorylogic logic; File Size225KB，9 Pages; ManufacturerHarris; Websitehttp://www.harris.com/

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5962R9572701VEC Overview

Decoder/Driver, HC/UH Series, Inverted Output, CMOS, CDIP16

5962R9572701VEC Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	unknown
ECCN code	EAR99
series	HC/UH
JESD-30 code	R-CDIP-T16
JESD-609 code	e4
Load capacitance (CL)	50 pF
Logic integrated circuit type	OTHER DECODER/DRIVER
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output polarity	INVERTED
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	RECTANGULAR
Package form	IN-LINE
propagation delay (tpd)	34 ns
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	GOLD
Terminal form	THROUGH-HOLE
Terminal location	DUAL
total dose	100k Rad(Si) V
Base Number Matches	1

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	5962R9572701VEC	5962R9572701VXC	HCS138DMSR	5962R9572701V9A	HCS138KMSR	HCS138HMSR
Description	Decoder/Driver, HC/UH Series, Inverted Output, CMOS, CDIP16	Decoder/Driver, HC/UH Series, Inverted Output, CMOS, CDFP16, CERAMIC, DFP-16	Decoder/Driver, HC/UH Series, Inverted Output, CMOS, CDIP16	Decoder/Driver, HC/UH Series, Inverted Output, CMOS	Decoder/Driver, HC/UH Series, Inverted Output, CMOS, CDFP16	Decoder/Driver, HC/UH Series, Inverted Output, CMOS
package instruction	,	,	DIP, DIP16,.3	DIE,	DFP, FL16,.3	DIE,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
series	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH
JESD-30 code	R-CDIP-T16	R-CDFP-F16	R-CDIP-T16	X-XUUC-N16	R-CDFP-F16	X-XUUC-N16
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF	50 pF
Number of functions	1	1	1	1	1	1
Number of terminals	16	16	16	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Output polarity	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED	INVERTED
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	UNSPECIFIED	RECTANGULAR	UNSPECIFIED
Package form	IN-LINE	FLATPACK	IN-LINE	UNCASED CHIP	FLATPACK	UNCASED CHIP
propagation delay (tpd)	34 ns	34 ns	34 ns	34 ns	34 ns	34 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	FLAT	THROUGH-HOLE	NO LEAD	FLAT	NO LEAD
Terminal location	DUAL	DUAL	DUAL	UPPER	DUAL	UPPER
JESD-609 code	e4	e4	e0	e0	e0	-
Terminal surface	GOLD	GOLD	Tin/Lead (Sn/Pb)	TIN LEAD	Tin/Lead (Sn/Pb)	-
total dose	100k Rad(Si) V	100k Rad(Si) V	200k Rad(Si) V	100k Rad(Si) V	200k Rad(Si) V	-
Base Number Matches	1	1	1	1	1	-
encapsulated code	-	-	DIP	DIE	DFP	DIE

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