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Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
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To understand why car engines need gearboxes, we must first understand the characteristics of different types of engines. An engine refers to a machine that can convert a form of energy into kineti...[Details]
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New energy pure electric vehicles generally accelerate faster than comparable fuel-powered vehicles, both from a standing start and while accelerating. Many believe this is simply due to the motor'...[Details]
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Recently,
Xpeng Motors and Xinlian Integrated Circuit jointly announced the mass production of China's first hybrid silicon carbide product.
Designed and developed by Xpeng Motors and joint...[Details]
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According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
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Core point: The automotive industry chain and the humanoid robot industry have collaborative advantages in hardware, software, and scenarios. Upstream and downstream companies in the automotive ind...[Details]
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On August 20th, Tiantai Robotics Co., Ltd., along with strategic partners including Shandong Future Robotics Technology Co., Ltd., Shandong Future Data Technology Co., Ltd., and Gangzai Robotics Gr...[Details]
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Pure electric vehicles, structurally speaking, have components such as a power battery. In addition to the power battery, a small battery also powers some low-voltage electrical components and even...[Details]
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With the advent of the electric car era, the number of pure electric vehicles has increased significantly, but many car owners do not know how to properly maintain pure electric vehicles. In additi...[Details]
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Keysight Technologies is combining its electromagnetic simulator with Synopsys' AI-driven RF design migration flow to create an integrated design flow for migrating from TSMC's N6RF+ process techno...[Details]
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Learned the following information.
Customer product: industrial computer motherboard
Glue application area: CPU/BGA filling
Glue color requirements: black or t...[Details]
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The 2025 China International Automotive Testing Exhibition will be held at the Shanghai World Expo Exhibition and Convention Center from August 27 to 29, 2025.
Clacton Seafront, UK, ...[Details]
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Plessey Semiconductors has been acquired by Haylo Labs, which was established in March last year with a $100 million, five-year loan from Chinese technology company Goertek.
Haylo Labs w...[Details]
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On August 20, Geely announced its focus on "One Cockpit". Through a unified AI OS architecture, a unified AI Agent, and a unified user ID, it will achieve an All-in-One AI cockpit, create the first...[Details]
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Tools/Materials
Yitong Chuanglian MODBUS to PROFIBUS Gateway YT-PB-03
Siemens s7-300
This article describes how to configure the YT-PB-03 MODBUS to PROFIBUS gat...[Details]