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MAX32665–MAX32668
General Description
Low-Power Arm Cortex-M4 with FPU-Based
Microcontroller with Bluetooth 5 for Wearables
Benefits and Features
●
High-Efficiency Microcontroller and Audio DSP for
Wearable and Hearable Devices
• Arm Cortex-M4 with FPU Up to 96MHz
• Optional Second Arm Cortex-M4 with FPU
Optimized for Data Processing
• Low-Power 7.3728MHz System Clock Option
• 1MB Flash, Organized into Dual Banks 2 x 512KB
• 560KB (448KB ECC) SRAM; 3 x 16KB Cache
• Optional Error Correction Code (ECC-SEC-DED)
for Cache, SRAM, and Internal Flash
●
Bluetooth 5 Low Energy Radio
• Up to 2Mbps Data Throughput
• Long Range (125kbps and 500kbps)
• Rx Sensitivity: -95dbm; Tx Power: +9.5dbm
• Single-Ended Antenna Connection
●
Power Management Maximizes Operating Time for
Battery Applications
• Integrated SIMO SMPS for Coin-Cell Operation
• Dynamic Voltage Scaling Minimizes Active Core
Power Consumption
•
27.3μA/MHz at 3.3V Executing from Cache
•
12.3μA at 3.3V Retention Current for 32KB SRAM
• Selectable SRAM Retention in Low Power Modes
with RTC Enabled
●
Multiple Peripherals for System Control
• Three QSPI Master/Slave with Three Chip Selects
Each, Three 4-Wire UARTs, Three I
2
C Master/Slave
• QSPI (SPIXF) with Real-Time Flash Decryption
• QSPI (SPIXR) RAM Interface Provides SRAM
Expansion
• 8-Input, 10-Bit Delta-Sigma ADC 7.8ksps
• USB 2.0 HS Engine with Internal Transceiver
• PDM Interface Supports Two Digital Microphones
• I
2
S with TDM, Six 32-Bit Timers, Two High-Speed
Timers, 1-Wire Master, Sixteen Pulse Train (PWM)
Engines
• Secure Digital Interface Supports SD3.0/SDIO3.0/
eMMC4.51
●
Secure Valuable IP/Data with Hardware Security
• Trust Protection Unit (TPU) with MAA Supports
Fast ECDSA and Modular Arithmetic
• AES-128, -192, -256, DES, 3DES, Hardware
Accelerator
• TRNG Seed Generator, SHA-2 Accelerator
• Secure Bootloader
Ordering Information
appears at end of data sheet.
DARWIN is a new breed of low-power microcontrollers
built to thrive in the rapidly evolving Internet of Things
(IoT). They are smart, with the biggest memories in their
class and a massively scalable memory architecture. They
run forever, thanks to wearable-grade power technology.
They are durable enough to withstand the most advanced
cyberattacks. DARWIN microcontrollers are designed
to run any application imaginable—in places where you
would not dream of sending other microcontrollers.
Generation UB microcontrollers are designed to han-
dle the increasingly complex applications demanded by
today's advanced battery-powered devices and wirelessly
connected devices, while providing robust hardware secu-
rity and Bluetooth
®
5 Low Energy (BLE) radio connectivity.
The MAX32665–MAX32668 UB class microcontrollers
are advanced systems-on-chips featuring an Arm
®
Cortex
®
-M4 with FPU CPU for efficient computation of
complex functions and algorithms with integrated power
management. They also include the newest generation
Bluetooth 5 Low Energy radio with support for long range
(4x) and high throughput (2Mbps) and Maxim's best-in-
class hardware security suite trust protection unit (TPU).
The devices offer large on-board memory with 1MB flash
and up to 560KB SRAM that can be configured as 448KB
SRAM with error correction coding (ECC). Split flash banks
of 512KB each support seamless over the air upgrades,
adding an additional degree of reliability. Memory scalabil-
ity of data (SRAM) and code (flash) space is supported by
two SPI execute-in-place (SPIX) interfaces.
Multiple high-speed interfaces are supported including
HS-USB, secure digital interface (SD, SDIO, MMC, SDHC,
and microSD™), SPI, UART, and I
2
C serial interfaces, and
an audio subsystem supporting PDM, PCM, I
2
S, and TDM
interfaces. An 8-input, 10-bit ADC is available to moni-
tor analog inputs from external sensors and meters. The
devices are available in 109-bump WLP (0.35mm pitch)
and 121-bump CTBGA (0.65mm pitch) packages.
Applications
●
Connected Home
●
Industrial Sensors
●
Payment/Fitness/Medical Wearables
●
Telemedicine
●
Gaming Devices
●
Hearables
19-100411; Rev 0; 10/18
MAX32665–MAX32668
Low-Power Arm Cortex-M4 with FPU-Based
Microcontroller with Bluetooth 5 for Wearables
Absolute Maximum Ratings
V
COREA
..............................................................-0.3V to +1.21V
V
COREB
..............................................................-0.3V to +1.21V
V
DDA
..................................................................-0.3V to +1.98V
V
DDIO
.................................................................-0.3V to +1.98V
V
DDIOH
.................................................................-0.3V to +3.6V
V
REGI
...................................................................-0.3V to +3.6V
V
TXIN
....................................................................-0.3V to +1.9V
V
RXIN
....................................................................-0.3V to +1.9V
V
DDA_BT[1:5]
...........................................................-0.3V to +1V
RSTN, GPIO (V
DDIO
) .............................. -0.3V to V
DDIO
+ 0.5V
GPIO (V
DDIOH
) ..................................... -0.3V to V
DDIOH
+ 0.5V
32KIN, 32KOUT........................................ -0.3V to V
DDA
+ 0.2V
HFXIN, HFXOUT ...................................... -0.3V to V
DDA
+ 0.2V
AIN[7:0].................................................................-0.3V to +3.6V
V
DDB
....................................................................-0.3V to +3.6V
DM, DP .................................................................-0.3V to +3.6V
V
DDIO
Combined Pins (sink) ............................................100mA
V
DDIOH
Combined Pins (sink) .........................................100mA
V
SSA
.................................................................................100mA
V
SS
...................................................................................100mA
V
SSPWR
...........................................................................100mA
V
SSA_BT[1:5]
.....................................................................100mA
Output Current (sink) by Any GPIO Pin .............................25mA
Output Current (source) by Any GPIO Pin ........................-25mA
Continuous Package Power Dissipation
CTBGA (multilayer board) T
A
= +70°C
(derate 31.0mW/°C above +70°C) ............................1692mW
Operating Temperature Range ......................... -40°C to +105°C
Storage Temperature Range ............................ -65°C to +150°C
Soldering Temperature ....................................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
109 WLP
Package Code
Outline Number
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
38.05°C/W
N/A
X12188+6C
21-0680
90-0451
32.5°C/W
8.8°C/W
W1093A4+1
21-100301
Refer to
Application Note 1891
121 CTBGA
Package Code
Outline Number
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θ
JA
)
Junction to Case (θ
JC
)
For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages.
Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated
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