IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CDFP14, CERAMIC, DFP-14, Gate
| Parameter Name | Attribute value |
| Maker | NXP |
| Parts packaging code | DFP |
| package instruction | CERAMIC, DFP-14 |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| series | F/FAST |
| JESD-30 code | R-CDFP-F14 |
| length | 9.906 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | OR GATE |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Maximum supply current (ICC) | 15.5 mA |
| propagation delay (tpd) | 6.3 ns |
| Certification status | Not Qualified |
| Maximum seat height | 2.159 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 6.2865 mm |
| Base Number Matches | 1 |
| N54F32/BDA | N54F32/B2A | 54F32/BCA | 54F32/B2A | 54F32/BDA | |
|---|---|---|---|---|---|
| Description | IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CDFP14, CERAMIC, DFP-14, Gate | IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CQCC20, CERAMIC, LLCC-20, Gate | IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CDIP14, Gate | IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CQCC20, Gate | IC F/FAST SERIES, QUAD 2-INPUT OR GATE, CDFP14, Gate |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| series | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
| JESD-30 code | R-CDFP-F14 | S-CQCC-N20 | R-GDIP-T14 | S-CQCC-N20 | R-CDFP-F14 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
| Number of functions | 4 | 4 | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 14 | 20 | 14 | 20 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP | QCCN | DIP | QCCN | DFP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK |
| Maximum supply current (ICC) | 15.5 mA | 15.5 mA | 15.5 mA | 15.5 mA | 15.5 mA |
| propagation delay (tpd) | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns | 6.3 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | FLAT |
| Terminal location | DUAL | QUAD | DUAL | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Maker | NXP | NXP | - | NXP | - |
| package instruction | CERAMIC, DFP-14 | CERAMIC, LLCC-20 | DIP, | - | DFP, |
| Maximum seat height | 2.159 mm | 1.905 mm | 5.08 mm | - | - |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | - | - |
| width | 6.2865 mm | 8.89 mm | 7.62 mm | - | - |
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