5430DMBQ datasheet, PDF - EEWORLD Datasheet

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5430DMBQ: DescriptionTTL/H/L SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14; Categorylogic logic; File Size95KB，2 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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5430DMBQ Overview

TTL/H/L SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14

5430DMBQ Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP,
Contacts	14
Reach Compliance Code	unknown
series	TTL/H/L
JESD-30 code	R-GDIP-T14
length	19.43 mm
Logic integrated circuit type	NAND GATE
Number of functions	1
Number of entries	8
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
propagation delay (tpd)	15 ns
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm
Base Number Matches	1

5430DMBQ Related Products

	5430DMBQ	5430FMQB	DM7430N	DM5430W	DM5430J
Description	TTL/H/L SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14	TTL/H/L SERIES, 8-INPUT NAND GATE, CDFP14, CERAMIC, FP-14	TTL/H/L SERIES, 8-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14	TTL/H/L SERIES, 8-INPUT NAND GATE, CDFP14, CERAMIC, FP-14	TTL/H/L SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP,	QFF, FL14,.3	DIP, DIP14,.3	QFF, FL14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
series	TTL/H/L	TTL/H/L	TTL/H/L	-	TTL/H/L
JESD-30 code	R-GDIP-T14	R-GDFP-F14	R-PDIP-T14	-	R-GDIP-T14
length	19.43 mm	-	19.18 mm	-	19.43 mm
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	-	NAND GATE
Number of functions	1	1	1	-	1
Number of entries	8	8	8	-	8
Number of terminals	14	14	14	-	14
Maximum operating temperature	125 °C	125 °C	70 °C	-	125 °C
Minimum operating temperature	-55 °C	-55 °C	-	-	-55 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	-	CERAMIC, GLASS-SEALED
encapsulated code	DIP	QFF	DIP	-	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	IN-LINE	FLATPACK	IN-LINE	-	IN-LINE
propagation delay (tpd)	15 ns	15 ns	15 ns	-	15 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	5.08 mm	2.032 mm	5.08 mm	-	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.25 V	-	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.75 V	-	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	-	5 V
surface mount	NO	YES	NO	-	NO
technology	TTL	TTL	TTL	-	TTL
Temperature level	MILITARY	MILITARY	COMMERCIAL	-	MILITARY
Terminal form	THROUGH-HOLE	FLAT	THROUGH-HOLE	-	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	-	2.54 mm
Terminal location	DUAL	DUAL	DUAL	-	DUAL
width	7.62 mm	6.35 mm	7.62 mm	-	7.62 mm
Base Number Matches	1	1	1	-	-
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible
JESD-609 code	-	e0	e0	-	e0
MaximumI(ol)	-	0.016 A	0.016 A	-	0.016 A
Encapsulate equivalent code	-	FL14,.3	DIP14,.3	-	DIP14,.3
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
power supply	-	5 V	5 V	-	5 V
Maximum supply current (ICC)	-	6 mA	6 mA	-	6 mA
Prop。Delay @ Nom-Sup	-	22 ns	22 ns	-	22 ns
Schmitt trigger	-	NO	NO	-	NO
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED

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