TTL/H/L SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| series | TTL/H/L |
| JESD-30 code | R-GDIP-T14 |
| JESD-609 code | e0 |
| length | 19.43 mm |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.016 A |
| Number of functions | 1 |
| Number of entries | 8 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Maximum supply current (ICC) | 6 mA |
| Prop。Delay @ Nom-Sup | 22 ns |
| propagation delay (tpd) | 15 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| DM5430J | 5430FMQB | 5430DMBQ | DM7430N | DM5430W | |
|---|---|---|---|---|---|
| Description | TTL/H/L SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | TTL/H/L SERIES, 8-INPUT NAND GATE, CDFP14, CERAMIC, FP-14 | TTL/H/L SERIES, 8-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14 | TTL/H/L SERIES, 8-INPUT NAND GATE, PDIP14, PLASTIC, DIP-14 | TTL/H/L SERIES, 8-INPUT NAND GATE, CDFP14, CERAMIC, FP-14 |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP14,.3 | QFF, FL14,.3 | DIP, | DIP, DIP14,.3 | QFF, FL14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible |
| series | TTL/H/L | TTL/H/L | TTL/H/L | TTL/H/L | - |
| JESD-30 code | R-GDIP-T14 | R-GDFP-F14 | R-GDIP-T14 | R-PDIP-T14 | - |
| JESD-609 code | e0 | e0 | - | e0 | - |
| length | 19.43 mm | - | 19.43 mm | 19.18 mm | - |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | - |
| MaximumI(ol) | 0.016 A | 0.016 A | - | 0.016 A | - |
| Number of functions | 1 | 1 | 1 | 1 | - |
| Number of entries | 8 | 8 | 8 | 8 | - |
| Number of terminals | 14 | 14 | 14 | 14 | - |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 70 °C | - |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | - | - |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - |
| encapsulated code | DIP | QFF | DIP | DIP | - |
| Encapsulate equivalent code | DIP14,.3 | FL14,.3 | - | DIP14,.3 | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | IN-LINE | FLATPACK | IN-LINE | IN-LINE | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| power supply | 5 V | 5 V | - | 5 V | - |
| Maximum supply current (ICC) | 6 mA | 6 mA | - | 6 mA | - |
| Prop。Delay @ Nom-Sup | 22 ns | 22 ns | - | 22 ns | - |
| propagation delay (tpd) | 15 ns | 15 ns | 15 ns | 15 ns | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| Schmitt trigger | NO | NO | - | NO | - |
| Maximum seat height | 5.08 mm | 2.032 mm | 5.08 mm | 5.08 mm | - |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.25 V | - |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.75 V | - |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | - |
| surface mount | NO | YES | NO | NO | - |
| technology | TTL | TTL | TTL | TTL | - |
| Temperature level | MILITARY | MILITARY | MILITARY | COMMERCIAL | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | - |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | - |
| Terminal location | DUAL | DUAL | DUAL | DUAL | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | - |
| width | 7.62 mm | 6.35 mm | 7.62 mm | 7.62 mm | - |
| Base Number Matches | - | 1 | 1 | 1 | - |