IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,DIP,16PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Reach Compliance Code | not_compliant |
| JESD-30 code | R-XDIP-T16 |
| Logic integrated circuit type | J-K FLIP-FLOP |
| MaximumI(ol) | 0.004 A |
| Number of functions | 2 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Maximum supply current (ICC) | 6 mA |
| Prop。Delay @ Nom-Sup | 20 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Trigger type | NEGATIVE EDGE |
| Base Number Matches | 1 |
| T54LS76AD2 | T74LS76AC1 | T74LS76AM1 | T74LS76AB1 | T74LS76AD1 | |
|---|---|---|---|---|---|
| Description | IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,DIP,16PIN,CERAMIC | IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,LDCC,20PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,SOP,16PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,DIP,16PIN,PLASTIC | IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,DIP,16PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 code | R-XDIP-T16 | S-PQCC-J20 | R-PDSO-G16 | R-PDIP-T16 | R-XDIP-T16 |
| Logic integrated circuit type | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
| MaximumI(ol) | 0.004 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| Number of functions | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 16 | 20 | 16 | 16 | 16 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
| encapsulated code | DIP | QCCJ | SOP | DIP | DIP |
| Encapsulate equivalent code | DIP16,.3 | LDCC20,.4SQ | SOP16,.25 | DIP16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | SMALL OUTLINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 6 mA | 6 mA | 6 mA | 6 mA | 6 mA |
| Prop。Delay @ Nom-Sup | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | YES | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | J BEND | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL |
| Trigger type | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
京公网安备 11010802033920号
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