T74LS76AD1 datasheet, PDF - EEWORLD Datasheet

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T74LS76AD1: DescriptionIC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,DIP,16PIN,CERAMIC; Categorylogic logic; File Size485KB，8 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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T74LS76AD1 Overview

IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,DIP,16PIN,CERAMIC

T74LS76AD1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Reach Compliance Code	not_compliant
JESD-30 code	R-XDIP-T16
Logic integrated circuit type	J-K FLIP-FLOP
MaximumI(ol)	0.008 A
Number of functions	2
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Maximum supply current (ICC)	6 mA
Prop。Delay @ Nom-Sup	20 ns
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Trigger type	NEGATIVE EDGE
Base Number Matches	1

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T74LS76AD1 Related Products

	T74LS76AD1	T74LS76AC1	T74LS76AM1	T54LS76AD2	T74LS76AB1
Description	IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,DIP,16PIN,CERAMIC	IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,LDCC,20PIN,PLASTIC	IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,SOP,16PIN,PLASTIC	IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,DIP,16PIN,CERAMIC	IC,FLIP-FLOP,DUAL,J/K TYPE,LS-TTL,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-XDIP-T16	S-PQCC-J20	R-PDSO-G16	R-XDIP-T16	R-PDIP-T16
Logic integrated circuit type	J-K FLIP-FLOP	J-K FLIP-FLOP	J-K FLIP-FLOP	J-K FLIP-FLOP	J-K FLIP-FLOP
MaximumI(ol)	0.008 A	0.008 A	0.008 A	0.004 A	0.008 A
Number of functions	2	2	2	2	2
Number of terminals	16	20	16	16	16
Maximum operating temperature	70 °C	70 °C	70 °C	125 °C	70 °C
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ	SOP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	LDCC20,.4SQ	SOP16,.25	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	SMALL OUTLINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V
Maximum supply current (ICC)	6 mA	6 mA	6 mA	6 mA	6 mA
Prop。Delay @ Nom-Sup	20 ns	20 ns	20 ns	20 ns	20 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	NO	NO
technology	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	J BEND	GULL WING	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL
Trigger type	NEGATIVE EDGE	NEGATIVE EDGE	NEGATIVE EDGE	NEGATIVE EDGE	NEGATIVE EDGE
Base Number Matches	1	1	1	1	1

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