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HB56A464EJ-8B

Description
Fast Page DRAM Module, 4MX64, 80ns, BICMOS, DIMM-168
Categorystorage    storage   
File Size353KB,13 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
Download Datasheet Parametric Compare View All

HB56A464EJ-8B Overview

Fast Page DRAM Module, 4MX64, 80ns, BICMOS, DIMM-168

HB56A464EJ-8B Parametric

Parameter NameAttribute value
MakerHitachi (Renesas )
Parts packaging codeDIMM
package instructionDIMM, DIMM168
Contacts168
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFAST PAGE
Maximum access time80 ns
Other featuresRAS ONLY/CAS BEFORE RAS REFRESH
I/O typeCOMMON
JESD-30 codeR-XDMA-N168
memory density268435456 bit
Memory IC TypeFAST PAGE DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals168
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize4MX64
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIMM
Encapsulate equivalent codeDIMM168
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
power supply5 V
Certification statusNot Qualified
refresh cycle4096
Maximum standby current0.08 A
Maximum slew rate1.104 mA
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyBICMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Base Number Matches1

HB56A464EJ-8B Related Products

HB56A464EJ-8B HB56A464EJ-6B HB56A464EJ-7B
Description Fast Page DRAM Module, 4MX64, 80ns, BICMOS, DIMM-168 Fast Page DRAM Module, 4MX64, 60ns, BICMOS, DIMM-168 Fast Page DRAM Module, 4MX64, 70ns, BICMOS, DIMM-168
Maker Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas )
Parts packaging code DIMM DIMM DIMM
package instruction DIMM, DIMM168 DIMM, DIMM168 DIMM, DIMM168
Contacts 168 168 168
Reach Compliance Code unknown unknown unknown
ECCN code EAR99 EAR99 EAR99
access mode FAST PAGE FAST PAGE FAST PAGE
Maximum access time 80 ns 60 ns 70 ns
Other features RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH
I/O type COMMON COMMON COMMON
JESD-30 code R-XDMA-N168 R-XDMA-N168 R-XDMA-N168
memory density 268435456 bit 268435456 bit 268435456 bit
Memory IC Type FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
memory width 64 64 64
Number of functions 1 1 1
Number of ports 1 1 1
Number of terminals 168 168 168
word count 4194304 words 4194304 words 4194304 words
character code 4000000 4000000 4000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 4MX64 4MX64 4MX64
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIMM DIMM DIMM
Encapsulate equivalent code DIMM168 DIMM168 DIMM168
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
refresh cycle 4096 4096 4096
Maximum standby current 0.08 A 0.08 A 0.08 A
Maximum slew rate 1.104 mA 1.344 mA 1.184 mA
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO NO
technology BICMOS BICMOS BICMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL
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