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4023BDM

Description
NAND Gate, CMOS, CDIP14,
Categorylogic    logic   
File Size199KB,5 Pages
ManufacturerFairchild
Websitehttp://www.fairchildsemi.com/
Download Datasheet Parametric Compare View All

4023BDM Overview

NAND Gate, CMOS, CDIP14,

4023BDM Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerFairchild
Reach Compliance Codecompliant
JESD-30 codeR-XDIP-T14
JESD-609 codee0
Logic integrated circuit typeNAND GATE
Humidity sensitivity level2A
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)250
power supply5/15 V
Certification statusNot Qualified
Schmitt triggerNO
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
Base Number Matches1

4023BDM Related Products

4023BDM 5962-01-139-4087 5962-01-123-6929 5962-01-047-7395 SMDP1206DTEO5050 5962-01-195-4644
Description NAND Gate, CMOS, CDIP14, NAND Gate, CMOS, PDIP14, NAND Gate, CMOS, CDIP14, NAND Gate, CMOS, CDIP14, Fixed Resistor, Metal Glaze/thick Film, 0.33W, 505ohm, 200V, 0.5% +/-Tol, -100,100ppm/Cel, 1206, NAND Gate, CMOS, CDFP14,
Is it Rohs certified? incompatible incompatible incompatible incompatible conform to incompatible
Reach Compliance Code compliant compli compliant compliant compliant compliant
Number of terminals 14 14 14 14 2 14
Maximum operating temperature 125 °C 85 °C 125 °C 85 °C 155 °C 125 °C
Minimum operating temperature -55 °C -40 °C -55 °C -40 °C -55 °C -55 °C
Package form IN-LINE IN-LINE IN-LINE IN-LINE SMT FLATPACK
technology CMOS CMOS CMOS CMOS METAL GLAZE/THICK FILM CMOS
Is it lead-free? Contains lead Contains lead Contains lead Contains lead - Contains lead
JESD-30 code R-XDIP-T14 R-PDIP-T14 R-XDIP-T14 R-XDIP-T14 - R-XDFP-F14
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE - NAND GATE
Humidity sensitivity level 2A 2A 2A 2A - 2A
Package body material CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC - CERAMIC
encapsulated code DIP DIP DIP DIP - DFP
Encapsulate equivalent code DIP14,.3 DIP14,.3 DIP14,.3 DIP14,.3 - FL14,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
Peak Reflow Temperature (Celsius) 250 250 250 250 - 250
power supply 5/15 V 5/15 V 5/15 V 5/15 V - 5/15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
Schmitt trigger NO NO NO NO - NO
surface mount NO NO NO NO - YES
Temperature level MILITARY INDUSTRIAL MILITARY INDUSTRIAL - MILITARY
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE - FLAT
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm - 1.27 mm
Terminal location DUAL DUAL DUAL DUAL - DUAL
Maximum time at peak reflow temperature 30 30 30 30 - 30
Base Number Matches 1 1 1 1 - 1
package instruction - DIP, DIP14,.3 DIP, DIP14,.3 DIP, DIP14,.3 - DFP, FL14,.3
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