4023BDM datasheet, PDF - EEWORLD Datasheet

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4023BDM: DescriptionNAND Gate, CMOS, CDIP14,; Categorylogic logic; File Size199KB，5 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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4023BDM Overview

NAND Gate, CMOS, CDIP14,

4023BDM Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Fairchild
Reach Compliance Code	compliant
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Logic integrated circuit type	NAND GATE
Humidity sensitivity level	2A
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	250
power supply	5/15 V
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
Base Number Matches	1

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4023BDM Related Products

	4023BDM	5962-01-139-4087	5962-01-123-6929	5962-01-047-7395	SMDP1206DTEO5050	5962-01-195-4644
Description	NAND Gate, CMOS, CDIP14,	NAND Gate, CMOS, PDIP14,	NAND Gate, CMOS, CDIP14,	NAND Gate, CMOS, CDIP14,	Fixed Resistor, Metal Glaze/thick Film, 0.33W, 505ohm, 200V, 0.5% +/-Tol, -100,100ppm/Cel, 1206,	NAND Gate, CMOS, CDFP14,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	conform to	incompatible
Reach Compliance Code	compliant	compli	compliant	compliant	compliant	compliant
Number of terminals	14	14	14	14	2	14
Maximum operating temperature	125 °C	85 °C	125 °C	85 °C	155 °C	125 °C
Minimum operating temperature	-55 °C	-40 °C	-55 °C	-40 °C	-55 °C	-55 °C
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMT	FLATPACK
technology	CMOS	CMOS	CMOS	CMOS	METAL GLAZE/THICK FILM	CMOS
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	-	Contains lead
JESD-30 code	R-XDIP-T14	R-PDIP-T14	R-XDIP-T14	R-XDIP-T14	-	R-XDFP-F14
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	-	NAND GATE
Humidity sensitivity level	2A	2A	2A	2A	-	2A
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	-	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	-	DFP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	-	FL14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Peak Reflow Temperature (Celsius)	250	250	250	250	-	250
power supply	5/15 V	5/15 V	5/15 V	5/15 V	-	5/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Schmitt trigger	NO	NO	NO	NO	-	NO
surface mount	NO	NO	NO	NO	-	YES
Temperature level	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	-	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	-	FLAT
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	-	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	-	DUAL
Maximum time at peak reflow temperature	30	30	30	30	-	30
Base Number Matches	1	1	1	1	-	1
package instruction	-	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3	-	DFP, FL14,.3

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