5962-01-139-4087 datasheet, PDF

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5962-01-139-4087: DescriptionNAND Gate, CMOS, PDIP14,; Categorylogic logic; File Size199KB，5 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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5962-01-139-4087 Overview

NAND Gate, CMOS, PDIP14,

5962-01-139-4087 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
package instruction	DIP, DIP14,.3
Reach Compliance Code	compli
JESD-30 code	R-PDIP-T14
Logic integrated circuit type	NAND GATE
Humidity sensitivity level	2A
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	250
power supply	5/15 V
Certification status	Not Qualified
Schmitt trigger	NO
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
Base Number Matches	1

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5962-01-139-4087 Related Products

	5962-01-139-4087	5962-01-123-6929	4023BDM	5962-01-047-7395	SMDP1206DTEO5050	5962-01-195-4644
Description	NAND Gate, CMOS, PDIP14,	NAND Gate, CMOS, CDIP14,	NAND Gate, CMOS, CDIP14,	NAND Gate, CMOS, CDIP14,	Fixed Resistor, Metal Glaze/thick Film, 0.33W, 505ohm, 200V, 0.5% +/-Tol, -100,100ppm/Cel, 1206,	NAND Gate, CMOS, CDFP14,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	conform to	incompatible
Reach Compliance Code	compli	compliant	compliant	compliant	compliant	compliant
Number of terminals	14	14	14	14	2	14
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C	155 °C	125 °C
Minimum operating temperature	-40 °C	-55 °C	-55 °C	-40 °C	-55 °C	-55 °C
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	SMT	FLATPACK
technology	CMOS	CMOS	CMOS	CMOS	METAL GLAZE/THICK FILM	CMOS
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	-	Contains lead
package instruction	DIP, DIP14,.3	DIP, DIP14,.3	-	DIP, DIP14,.3	-	DFP, FL14,.3
JESD-30 code	R-PDIP-T14	R-XDIP-T14	R-XDIP-T14	R-XDIP-T14	-	R-XDFP-F14
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	-	NAND GATE
Humidity sensitivity level	2A	2A	2A	2A	-	2A
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	-	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	-	DFP
Encapsulate equivalent code	DIP14,.3	DIP14,.3	DIP14,.3	DIP14,.3	-	FL14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Peak Reflow Temperature (Celsius)	250	250	250	250	-	250
power supply	5/15 V	5/15 V	5/15 V	5/15 V	-	5/15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Schmitt trigger	NO	NO	NO	NO	-	NO
surface mount	NO	NO	NO	NO	-	YES
Temperature level	INDUSTRIAL	MILITARY	MILITARY	INDUSTRIAL	-	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	-	FLAT
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	-	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	-	DUAL
Maximum time at peak reflow temperature	30	30	30	30	-	30
Base Number Matches	1	1	1	1	-	1

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