EE PLD, 20ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
| Parameter Name | Attribute value |
| Maker | Lattice |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 24 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| maximum clock frequency | 33.3 MHz |
| JESD-30 code | R-PDIP-T24 |
| length | 31.75 mm |
| Dedicated input times | 8 |
| Number of I/O lines | 8 |
| Number of terminals | 24 |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | |
| organize | 8 DEDICATED INPUTS, 8 I/O |
| Output function | MACROCELL |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Programmable logic type | EE PLD |
| propagation delay | 20 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage | 5.25 V |
| Minimum supply voltage | 4.75 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| ISPGAL16Z8-20LPB | ISPGAL16Z8-25LJB | ISPGAL16Z8-25LPB | ISPGAL16Z8-20LJB | |
|---|---|---|---|---|
| Description | EE PLD, 20ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | EE PLD, 25ns, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | EE PLD, 20ns, CMOS, PQCC28, PLASTIC, LCC-28 |
| Maker | Lattice | Lattice | Lattice | Lattice |
| Parts packaging code | DIP | QLCC | DIP | QLCC |
| package instruction | DIP, | QCCJ, | DIP, | QCCJ, |
| Contacts | 24 | 28 | 24 | 28 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| maximum clock frequency | 33.3 MHz | 28.5 MHz | 28.5 MHz | 33.3 MHz |
| JESD-30 code | R-PDIP-T24 | S-PQCC-J28 | R-PDIP-T24 | S-PQCC-J28 |
| length | 31.75 mm | 11.5316 mm | 31.75 mm | 11.5316 mm |
| Dedicated input times | 8 | 8 | 8 | 8 |
| Number of I/O lines | 8 | 8 | 8 | 8 |
| Number of terminals | 24 | 28 | 24 | 28 |
| Maximum operating temperature | 75 °C | 75 °C | 75 °C | 75 °C |
| organize | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O | 8 DEDICATED INPUTS, 8 I/O |
| Output function | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCJ | DIP | QCCJ |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| Programmable logic type | EE PLD | EE PLD | EE PLD | EE PLD |
| propagation delay | 20 ns | 25 ns | 25 ns | 20 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 4.57 mm | 5.08 mm | 4.57 mm |
| Maximum supply voltage | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | QUAD |
| width | 7.62 mm | 11.5316 mm | 7.62 mm | 11.5316 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |