EEWORLDEEWORLDEEWORLD

Part Number

Search

EDI8G32259V15MMC

Description
SRAM Module, 256KX32, 15ns, CMOS, PSMA72,
Categorystorage    storage   
File Size319KB,7 Pages
ManufacturerEDI [Electronic devices inc.]
Download Datasheet Parametric Compare View All

EDI8G32259V15MMC Overview

SRAM Module, 256KX32, 15ns, CMOS, PSMA72,

EDI8G32259V15MMC Parametric

Parameter NameAttribute value
MakerEDI [Electronic devices inc.]
Reach Compliance Codeunknown
Maximum access time15 ns
I/O typeCOMMON
JESD-30 codeR-PSMA-N72
memory density8388608 bit
Memory IC TypeSRAM MODULE
memory width32
Number of terminals72
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeSIMM
Encapsulate equivalent codeSSIM72
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
power supply3.3 V
Certification statusNot Qualified
Maximum seat height15.24 mm
Maximum standby current0.04 A
Minimum standby current3 V
Maximum slew rate1.44 mA
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationSINGLE
Base Number Matches1

EDI8G32259V15MMC Related Products

EDI8G32259V15MMC EDI8G32259V20MMC EDI8G32259V20MNC EDI8G32259V12MMC EDI8G32259V15MNC EDI8G32259V12MNC
Description SRAM Module, 256KX32, 15ns, CMOS, PSMA72, SRAM Module, 256KX32, 20ns, CMOS, PSMA72, SRAM Module, 256KX32, 20ns, CMOS, PSMA72, SRAM Module, 256KX32, 12ns, CMOS, PSMA72, SRAM Module, 256KX32, 15ns, CMOS, PSMA72, SRAM Module, 256KX32, 12ns, CMOS, PSMA72,
Maker EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.] EDI [Electronic devices inc.]
Reach Compliance Code unknown unknown unknown unknown unknown unknown
Maximum access time 15 ns 20 ns 20 ns 12 ns 15 ns 12 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PSMA-N72 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72 R-PSMA-N72
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32 32 32 32
Number of terminals 72 72 72 72 72 72
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX32 256KX32 256KX32 256KX32 256KX32 256KX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SIMM SIMM SIMM SIMM SIMM SIMM
Encapsulate equivalent code SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 15.24 mm 15.24 mm 17.272 mm 15.24 mm 17.272 mm 17.272 mm
Maximum standby current 0.04 A 0.04 A 0.04 A 0.04 A 0.04 A 0.04 A
Minimum standby current 3 V 3 V 3 V 3 V 3 V 3 V
Maximum slew rate 1.44 mA 1.44 mA 1.44 mA 1.44 mA 1.44 mA 1.44 mA
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Base Number Matches 1 1 1 1 1 1
How to implement macro compilation in VHDL
Dear colleagues, Now I have encountered a problem in the development process, and I would like to ask you for advice:In Verilog, we use macro compilation to automatically add version numbers to the pr...
patriotiii FPGA/CPLD
Compressed and uncompressed dll, xip dll and non-xip dll in wince
Due to the specific requirements of embedded systems, CE must use and save physical memory more effectively than desktop systems, and adopts ROM file system and RAM file system. [color=#0000FF] Compre...
xmjianfu Embedded System
Share the DXP package I just drew __STM32F407
The effect is as shown in the figure. The schematic source file is in the attachment. I sent a few PCB libraries. After a brief check, there should be no problem. If it is what you need, please give i...
fuqing5542 stm32/stm8
Detailed explanation of Linux 2.6 kernel Makefile
Being familiar with the kernel's Makefile is very important for developing device drivers and understanding the kernel code structure. Many features of the Linux 2.6 kernel Makefile are very different...
呱呱 Linux and Android
CMD issues regarding DSP 2812
I just started learning DSP. The chip I used is TMS320F2812. When I used the SRAM.CMD file to simulate, the program ran correctly. I used the timer to flip the IO port with a period of 1us. Everything...
tao122188 DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 500  2797  2615  2553  741  11  57  53  52  15 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号