54HC163M/B2AJC datasheet, PDF - EEWORLD Datasheet

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54HC163M/B2AJC: DescriptionIC,COUNTER,UP,4-BIT BINARY,HC-CMOS,LLCC,20PIN,CERAMIC; Categorylogic logic; File Size590KB，12 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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54HC163M/B2AJC Overview

IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,LLCC,20PIN,CERAMIC

54HC163M/B2AJC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	QCCN, LCC20,.35SQ
Reach Compliance Code	unknown
Counting direction	UP
JESD-30 code	S-XQCC-N20
JESD-609 code	e0
Load/preset input	YES
Logic integrated circuit type	BINARY COUNTER
Operating mode	SYNCHRONOUS
Number of functions	1
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC20,.35SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	2/6 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Base Number Matches	1

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Description	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,LLCC,20PIN,CERAMIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,CERAMIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,CERAMIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,LLCC,20PIN,CERAMIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,PLASTIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,PLASTIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	QCCN, LCC20,.35SQ	DIP, DIP16,.3	DIP, DIP16,.3	QCCN, LCC20,.35SQ	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Counting direction	UP	UP	UP	UP	UP	UP	UP
JESD-30 code	S-XQCC-N20	R-XDIP-T16	R-XDIP-T16	S-XQCC-N20	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Load/preset input	YES	YES	YES	YES	YES	YES	YES
Logic integrated circuit type	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Number of functions	1	1	1	1	1	1	1
Number of terminals	20	16	16	20	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	QCCN	DIP	DIP	QCCN	DIP	DIP	DIP
Encapsulate equivalent code	LCC20,.35SQ	DIP16,.3	DIP16,.3	LCC20,.35SQ	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	IN-LINE
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	NO	NO	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL
Maker	NXP	NXP	NXP	NXP	-	-	NXP
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	-	-	-
Base Number Matches	1	1	1	1	1	1	-

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