MC54HC163AJ datasheet, PDF - EEWORLD Datasheet

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MC54HC163AJ: DescriptionIC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,CERAMIC; Categorylogic logic; File Size590KB，12 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC54HC163AJ Overview

IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,CERAMIC

MC54HC163AJ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Counting direction	UP
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Load capacitance (CL)	50 pF
Load/preset input	YES
Logic integrated circuit type	BINARY COUNTER
Maximum Frequency@Nom-Sup	30000000 Hz
MaximumI(ol)	0.004 A
Operating mode	SYNCHRONOUS
Number of functions	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	2/6 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

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Description	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,CERAMIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,CERAMIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,CERAMIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,LLCC,20PIN,CERAMIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,LLCC,20PIN,CERAMIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,PLASTIC	IC,COUNTER,UP,4-BIT BINARY,HC-CMOS,DIP,16PIN,PLASTIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	QCCN, LCC20,.35SQ	QCCN, LCC20,.35SQ	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Counting direction	UP	UP	UP	UP	UP	UP	UP
JESD-30 code	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16	S-XQCC-N20	S-XQCC-N20	R-PDIP-T16	R-PDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Load/preset input	YES	YES	YES	YES	YES	YES	YES
Logic integrated circuit type	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER	BINARY COUNTER
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Number of functions	1	1	1	1	1	1	1
Number of terminals	16	16	16	20	20	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	QCCN	QCCN	DIP	DIP
Encapsulate equivalent code	DIP16,.3	DIP16,.3	DIP16,.3	LCC20,.35SQ	LCC20,.35SQ	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	IN-LINE
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL
Maker	NXP	NXP	NXP	NXP	NXP	-	-
Filter level	-	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	-	-
Base Number Matches	-	1	1	1	1	1	1

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