M54HC32F1 datasheet, PDF - EEWORLD Datasheet

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M54HC32F1: DescriptionHC/UH SERIES, QUAD 2-INPUT OR GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14; Categorylogic logic; File Size106KB，4 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M54HC32F1 Overview

HC/UH SERIES, QUAD 2-INPUT OR GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14

M54HC32F1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	DIP
package instruction	FRIT SEALED, CERAMIC, DIP-14
Contacts	14
Reach Compliance Code	not_compliant
series	HC/UH
JESD-30 code	R-GDIP-T14
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	OR GATE
MaximumI(ol)	0.004 A
Number of functions	4
Number of entries	2
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2/6 V
Prop。Delay @ Nom-Sup	27 ns
propagation delay (tpd)	27 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	5 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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M54HC32F1 Related Products

	M54HC32F1	M74HC32C1	M74HC32F1	M74HC32B1N	M74HC32M1
Description	HC/UH SERIES, QUAD 2-INPUT OR GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14	HC/UH SERIES, QUAD 2-INPUT OR GATE, PQCC20, PLASTIC, CC-20	HC/UH SERIES, QUAD 2-INPUT OR GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14	HC/UH SERIES, QUAD 2-INPUT OR GATE, PDIP14, PLASTIC, DIP-14	HC/UH SERIES, QUAD 2-INPUT OR GATE, PDSO14, MICRO, PLASTIC, GULLWING, DIP-14
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	QFN	DIP	DIP	SOIC
package instruction	FRIT SEALED, CERAMIC, DIP-14	PLASTIC, CC-20	DIP, DIP14,.3	DIP, DIP14,.3	MICRO, PLASTIC, GULLWING, DIP-14
Contacts	14	20	14	14	14
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
series	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH
JESD-30 code	R-GDIP-T14	S-PQCC-J20	R-GDIP-T14	R-PDIP-T14	R-PDSO-G14
JESD-609 code	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	OR GATE	OR GATE	OR GATE	OR GATE	OR GATE
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Number of functions	4	4	4	4	4
Number of entries	2	2	2	2	2
Number of terminals	14	20	14	14	14
Maximum operating temperature	125 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ	DIP	DIP	SOP
Encapsulate equivalent code	DIP14,.3	LDCC20,.4SQ	DIP14,.3	DIP14,.3	SOP14,.25
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
Prop。Delay @ Nom-Sup	27 ns	23 ns	23 ns	23 ns	23 ns
propagation delay (tpd)	27 ns	23 ns	23 ns	23 ns	23 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO
Maximum seat height	5 mm	4.57 mm	5 mm	5.1 mm	1.75 mm
Maximum supply voltage (Vsup)	6 V	6 V	6 V	6 V	6 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V	2 V	2 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	GULL WING
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	8.9662 mm	7.62 mm	7.62 mm	3.9 mm
Maker	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics
Is it lead-free?	-	Contains lead	Contains lead	Contains lead	Contains lead

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