M74HC32M1 datasheet, PDF - EEWORLD Datasheet

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M74HC32M1: DescriptionHC/UH SERIES, QUAD 2-INPUT OR GATE, PDSO14, MICRO, PLASTIC, GULLWING, DIP-14; Categorylogic logic; File Size106KB，4 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M74HC32M1 Overview

HC/UH SERIES, QUAD 2-INPUT OR GATE, PDSO14, MICRO, PLASTIC, GULLWING, DIP-14

M74HC32M1 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	SOIC
package instruction	MICRO, PLASTIC, GULLWING, DIP-14
Contacts	14
Reach Compliance Code	not_compliant
series	HC/UH
JESD-30 code	R-PDSO-G14
JESD-609 code	e0
length	8.65 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	OR GATE
MaximumI(ol)	0.004 A
Number of functions	4
Number of entries	2
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP14,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2/6 V
Prop。Delay @ Nom-Sup	23 ns
propagation delay (tpd)	23 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.75 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3.9 mm

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M74HC32M1 Related Products

	M74HC32M1	M54HC32F1	M74HC32C1	M74HC32F1	M74HC32B1N
Description	HC/UH SERIES, QUAD 2-INPUT OR GATE, PDSO14, MICRO, PLASTIC, GULLWING, DIP-14	HC/UH SERIES, QUAD 2-INPUT OR GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14	HC/UH SERIES, QUAD 2-INPUT OR GATE, PQCC20, PLASTIC, CC-20	HC/UH SERIES, QUAD 2-INPUT OR GATE, CDIP14, FRIT SEALED, CERAMIC, DIP-14	HC/UH SERIES, QUAD 2-INPUT OR GATE, PDIP14, PLASTIC, DIP-14
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	SOIC	DIP	QFN	DIP	DIP
package instruction	MICRO, PLASTIC, GULLWING, DIP-14	FRIT SEALED, CERAMIC, DIP-14	PLASTIC, CC-20	DIP, DIP14,.3	DIP, DIP14,.3
Contacts	14	14	20	14	14
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
series	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH
JESD-30 code	R-PDSO-G14	R-GDIP-T14	S-PQCC-J20	R-GDIP-T14	R-PDIP-T14
JESD-609 code	e0	e0	e0	e0	e0
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	OR GATE	OR GATE	OR GATE	OR GATE	OR GATE
MaximumI(ol)	0.004 A	0.004 A	0.004 A	0.004 A	0.004 A
Number of functions	4	4	4	4	4
Number of entries	2	2	2	2	2
Number of terminals	14	14	20	14	14
Maximum operating temperature	85 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	SOP	DIP	QCCJ	DIP	DIP
Encapsulate equivalent code	SOP14,.25	DIP14,.3	LDCC20,.4SQ	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
Prop。Delay @ Nom-Sup	23 ns	27 ns	23 ns	23 ns	23 ns
propagation delay (tpd)	23 ns	27 ns	23 ns	23 ns	23 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	NO	NO	NO
Maximum seat height	1.75 mm	5 mm	4.57 mm	5 mm	5.1 mm
Maximum supply voltage (Vsup)	6 V	6 V	6 V	6 V	6 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V	2 V	2 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	QUAD	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	3.9 mm	7.62 mm	8.9662 mm	7.62 mm	7.62 mm
Is it lead-free?	Contains lead	-	Contains lead	Contains lead	Contains lead
Maker	STMicroelectronics	STMicroelectronics	-	STMicroelectronics	STMicroelectronics

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