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5962-9669105HYX

Description
Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32
Categorystorage    storage   
File Size489KB,10 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

5962-9669105HYX Overview

Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32

5962-9669105HYX Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeDIP
package instructionDIP,
Contacts32
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time55 ns
Other featuresTTL COMPATIBLE INPUTS AND OUTPUTS
JESD-30 codeR-CDIP-T32
JESD-609 codee4
length42.2 mm
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX8
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height5.13 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceGOLD
Terminal formTHROUGH-HOLE
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
White Electronic Designs
128Kx8 MONOLITHIC SRAM, SMD 5962-96691
FEATURES
Access Times 15, 17, 20, 25, 35, 45, 55ns
Revolutionary, Center Power/Ground Pinout JEDEC
Approved
• 32 lead Ceramic SOJ (Package 101)
• 36 lead Ceramic Flat Pack (Package 226)
Evolutionary, Corner Power/Ground Pinout JEDEC
Approved
• 32 pin Ceramic DIP (Package 300)
• 32 lead Ceramic SOJ (Package 101)
• 32 lead Ceramic Flat Pack (Package 206)
WMS128K8-XXX
32 pin, Rectangular Ceramic Leadless Chip Carrier
(Package 601)
MIL-STD-883 Compliant Devices Available
Commercial, Industrial and Military Temperature
Range
5 Volt Power Supply
Low Power CMOS
2V Data Retention Devices Available
(Low Power Version)
TTL Compatible Inputs and Outputs
This product is subject to change without notice.
Revolutionary Pinout
36 FLAT PACK
32 CSOJ (DR)
Evolutionary Pinout
32 DIP
32 CSOJ (DE)
32 FLATPACK (FE)
32 CLCC
Top View
NC
A0
A1
A2
A3
CS#
I/O0
I/O1
V
CC
GND
I/O2
I/O3
WE#
A4
A5
A6
A7
NC
Top View
NC
A16
A15
A14
A13
OE#
I/O7
I/O6
GND
V
CC
I/O5
I/O4
A12
A11
A10
A9
A8
NC
Top View
A16
A15
A14
A13
OE#
I/O8
I/O7
GND
V
CC
I/O6
I/O5
A12
A11
A10
A9
A8
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
Top View
V
CC
A15
NC
WE#
A13
A8
A9
A11
OE#
A10
CS#
I/O7
I/O6
I/O5
I/O4
I/O3
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
A0
A1
A2
A3
CS#
I/O1
I/O2
V
CC
GND
I/O3
I/O4
WE#
A4
A5
A6
A7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A12
A14
A16
A18
V
CC
A15
A17
4 3 2 1 32 31 30
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
14 15 16 17 18 19 20
WE#
A13
A8
A9
A11
OE#
A10
CS#
I/O7
Pin Description
A
0-16
I/O
0-7
CS
OE
WE
V
CC
GND
September 2002
Rev. 5
Address Inputs
Data Input/Output
Chip Select
Output Enable
Write Enable
+5.0V Power
Ground
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
I/O1
I/02
V
SS
I/O3
I/O4
I/O5
I/O6
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