5962-9073701MPA datasheet, PDF

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5962-9073701MPA: DescriptionSPST, 1 Func, CMOS, CDIP8,; CategoryAnalog mixed-signal IC The signal circuit; File Size292KB，9 Pages; ManufacturerVishay; Websitehttp://www.vishay.com

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5962-9073701MPA Overview

SPST, 1 Func, CMOS, CDIP8,

5962-9073701MPA Parametric

Parameter Name	Attribute value
Maker	Vishay
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	unknown
Analog Integrated Circuits - Other Types	SPST
JESD-30 code	R-XDIP-T8
normal position	NC
Number of functions	1
Number of terminals	8
Maximum on-state resistance (Ron)	45 Ω
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5,+-15 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
surface mount	NO
Maximum connection time	175 ns
switch	BREAK-BEFORE-MAKE
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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5962-9073701MPA Related Products

	5962-9073701MPA	5962-9073701MPX	5962-9073702MPX	5962-9073703MPA	5962-9073703MPX	5962-9073702MPA
Description	SPST, 1 Func, CMOS, CDIP8,	IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP8, CERAMIC, DIP-8, Multiplexer or Switch	IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP8, CERAMIC, DIP-8, Multiplexer or Switch	SPDT, 1 Func, CMOS, CDIP8,	IC 1-CHANNEL, SGL POLE SGL THROW SWITCH, CDIP8, CERAMIC, DIP-8, Multiplexer or Switch	SPST, 1 Func, CMOS, CDIP8,
Parts packaging code	DIP	DIP	DIP	DIP	DIP	DIP
package instruction	DIP, DIP8,.3	DIP,	DIP,	DIP, DIP8,.3	DIP,	DIP, DIP8,.3
Contacts	8	8	8	8	8	8
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
Analog Integrated Circuits - Other Types	SPST	SPST	SPST	SPDT	SPST	SPST
JESD-30 code	R-XDIP-T8	R-CDIP-T8	R-CDIP-T8	R-XDIP-T8	R-CDIP-T8	R-XDIP-T8
Number of functions	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8
Maximum on-state resistance (Ron)	45 Ω	35 Ω	35 Ω	45 Ω	35 Ω	45 Ω
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC	CERAMIC, METAL-SEALED COFIRED	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	NO	NO	NO	NO	NO	NO
Maximum connection time	175 ns	175 ns	175 ns	175 ns	175 ns	175 ns
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Base Number Matches	1	1	1	1	1	-

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